Process Engineer (Metallization)

About the Role

We are seeking a Process Engineer (Metallization) to support the development and optimization of Syenta’s core LEM metallization processes. This is a hands-on, high-impact role working at the heart of our technology — bridging experimental R&D, process engineering, and early-stage manufacturing.

Responsibilities

• Electroplating Process Ownership
• Support the development and performance of electroplating processes within Syenta’s LEM platform
• Develop and refine electrolyte chemistries, including optimization of additive systems (suppressors, accelerators, levellers, inhibitors)
• Define electrochemical deposition windows that balance performance, repeatability, and manufacturability
• Drive improvements in film properties including adhesion, stress, microstructure, uniformity, and defectivity
• Process Development & Optimization
• Design and execute structured experiments (DOE, parameter sweeps) across tightly coupled chemical and process variables
• Optimise deposition conditions (e.g. current density, waveform, transport effects) to improve yield and consistency
• Establish process control strategies, acceptance criteria, and repeatability standards
• Translate experimental results into actionable process improvements
• Defect Analysis & Process Improvement
• Investigate plating defects such as voids, seams, roughness, non-uniformity, stress cracking, and adhesion failures
• Correlate defects to chemistry, interfaces, transport, waveform, and tool behavior
• Implement corrective actions to improve process robustness and reduce variability
• Build mechanistic understanding to support long-term stability and scalability
• Scale-Up & Manufacturing Integration
• Translate lab-scale processes into stable, repeatable manufacturing workflows
• Support process transfer to pilot lines and external fabrication partners
• Identify and mitigate risks related to yield, cost, and scalability
• Contribute to process standardization and documentation for manufacturing readiness
• Technical Leadership & Cross-Functional Collaboration
• Act as a subject matter expert in electroplating and electrochemistry within the organization
• Work closely with materials, hardware, and product teams to integrate metallization processes into the broader system

Requirements

• B.S., M.S., or Ph.D. or equivalent industry experience in Chemistry, Electrochemistry, Materials Science, or Chemical Engineering
• 5+ years of hands-on experience in electroplating or electrochemical process development
• Strong experience with copper electroplating or similar metal deposition systems
• Background in semiconductor manufacturing, advanced packaging, or related high-precision industries
• Proven ability to solve complex process and defect-related challenges
• Strong experimental design (DOE), data analysis, and problem-solving capabilities
• Experience working in laboratory and/or cleanroom environments

Preferred Qualifications

• Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments
• Experience scaling processes from R&D through to manufacturing
• Familiarity with metrology and characterization tools (SEM, profilometry, electrical testing)
• Experience working with prototype or custom-built hardware systems
• Exposure to adjacent industries (PCB, MEMS, surface finishing) with relevance to high-resolution systems