Process Engineer II - Wire and Ribbon Bonding

Job Description This is a Weekend shift position, working Thursday, Friday, and Saturday as 12 hour days weekend nights 4pm to 4am. This shift receives a 15% differential and is paid 40 hours for 36 worked. Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time. See what you’re missing. Our employees work on the world’s most advanced electronics – from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®.” Sound like a team you want to be a part of? Come build your career with BAE Systems. Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safely. Position Summary BAE Systems is looking for a Bonding Process Engineer II to work in a fast-paced manufacturing environment at their Nashua, New Hampshire facility. Working closely with multi-disciplinary teams and being able to adapt to a rapidly changing production environment brings with it an exciting opportunity to influence the successful execution of production goals and achieving operational excellence. In this role, the process engineer will be responsible for process engineering, assembly process development, and new process implementation. Through hands-on problem solving, data analyses and application of Six Sigma and lean manufacturing principles, the process engineer will drive improvements in assembly processes, throughput and yields. You will serve as the subject matter expert, bridging the gap between engineering, product integration and stable, high yield manufacturing. Responsibilities May Include Provides process engineering support on current production programs and supports overall manufacturing execution to meet cost, quality and delivery targets.Proactively identifies process improvements and engages with factory and program teams to implement process changes and continuous improvement initiatives for achieving operational excellence.Day to day support of the production floor activities, driving defect reduction, root cause activities, and daily interaction with technicians and operators.Analyze defect data to identify areas to improve yield and reduce defects.Participates in and documents customer corrective action requests using 9 Step problem solving methodology. Performs Preliminary Material Review/Material Review Board (PMR/MRB) for the disposition of discrepant material and determination of root cause/corrective action.Defines and specifies the requirement for assembly tooling, fixtures and equipment to support current manufacturing operations and recommends changes for production ramp-ups.Engage in continuous improvement initiatives.Supports the implementation of new automation assembly equipment including programming, process qualifications and supporting tooling design through the tooling group.Performs other duties as assigned. Required Education, Experience, & Skills Education: Bachelor’s Degree preferred OR 2+ years of experience in a mechanical engineering or related field, electronics assembly, or semiconductor packaging, preferrably wire/wedge bonding micro-electronic subassemblies.Technical Skills: Proven ability to understand, analyze and resolve complex technical problems. Preferably in programming autobonding equipment.Adaptability: Ability to maintain high quality and accuracy while working in a fast-paced, production-driven environment.Must be able to obtain a secret clearance Preferred Education, Experience, & Skills Experience: 2+ years of direct experience wire/wedge bonding microelectronic subassemblies, preferably in programing autobonders (Palomar 8000/9000) & manual bonders (WestBond).Compliance Knowledge: Familiarity with strict quality and environmental standards such as MIL-STD-883, MIL-PRF-38534, ISO 9001, and AS9100. Prior experience working within a DoD environment, active or ability to acquire a secret security clearance. Relevant process engineering or manufacturing engineering industry experience, preferably in electro-mechanical manufacturing. Technical Proficiencies: Hands-on experience with wire bond equipment. Proficiency in CAD software (e.g., SolidWorks, AutoCAD). Analytical Skills: Demonstrated mastery of Design of Experiments (DOE), root cause analysis, and Statistical Process Control (SPC). Green Belt and Lean manufacturing training and demonstrated ability to apply these principles. Pay Information Full-Time Salary Range: $79365 - $134921 Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20+ hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics. About BAE Systems Electronic Systems BAE Systems, Inc. is the U.S. subsidiary of BAE Systems plc, an international defense, aerospace and security company which delivers a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support services. Improving the future and protecting lives is an ambitious mission, but it’s what we do at BAE Systems. Working here means using your passion and ingenuity where it counts – defending national security with breakthrough technology, superior products, and intelligence solutions. As you develop the latest technology and defend national security, you will continually hone your skills on a team—making a big impact on a global scale. At BAE Systems, you’ll find a rewarding career that truly makes a difference. Electronic Systems (ES) is the global innovator behind BAE Systems’ game-changing defense and commercial electronics. Exploiting every electron, we push the limits of what is possible, giving our customers the edge and our employees opportunities to change the world. Our products and capabilities can be found everywhere – from the depths of the ocean to the far reaches of space. At our core are more than 14,000 highly talented Electronic Systems employees with the brightest minds in the industry, we make an impact – for our customers and the communities we serve. This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.