Process Engineer I

About the role

Join UCT and be part of the fastest-growing sector in the world! We indirectly touch every semiconductor chip that goes into every smartphone, smart car, and device that uses artificial intelligence. This is a critical time for the semiconductor industry and for UCT—as technology evolves, we evolve with it. UCT is a diverse workplace where every talented employee is committed to continuous innovation, challenging the status quo and exceeding customer expectations. If you are a person with a relentless drive to succeed, a strong focus on quality, and a passion for success—join us today!

UCT is looking for a talented Process Engineer I to join us in Hillsboro, OR. The Process Engineer I supports the development, optimization, and scaling of industrial processes to ensure efficient production and high-quality output. This role involves assisting with equipment design, process improvements, and control system implementation while maintaining compliance with environmental, health, and safety standards. The Process Engineer I contributes to process qualification, troubleshooting, and continuous improvement initiatives across multiple workstations and technologies.

Responsibilities

• Complete QGT/UCT Policy Training, Safety Training, and Engineering Specific Training.
• Participate in Smelter rotation (1).
• Develop basic knowledge in all process workstations.
• Gain hands-on experience with Logistics and PartSmart systems.
• Complete Chem Line and Blast Line orientation with hands-on experience.
• Familiarize with Clean Room protocols, including all CR CDI tests, and basic micro-contamination knowledge.
• Complete Coatings orientation and gain hands-on experience.
• Participate in the Perfect Qual Program and perform quals under supervision.
• Engage in CAPA, FOI, and FMEA investigations.
• Develop basic semiconductor process knowledge (PVD, Etch, ALD, Diffusion, etc.).
• Understand OEM platform and part knowledge (AMAT, LAM, ASM, etc.).
• Learn basics of Chemtrace™, Ionic, and organic analysis.
• Apply basic statistical analysis/SPC.
• Perform other duties as assigned; responsibilities may change at any time with or without notice.

Requirements

• Bachelor’s degree in Engineering or equivalent on-the-job experience in parts cleaning manufacturing.
• 1–2 years of related experience in high-technology manufacturing, preferably in semiconductor capital equipment or a related industry.

Skills

• Basic knowledge of all process workstations.
• Basic PartSmart usage and searches.
• Familiarity with most chemistries for films on substrates.
• Knowledge of media/pressure combinations for surface roughness (Ra) on substrates.
• Familiarity with Clean Room protocols and micro-contamination knowledge.
• Ability to perform CR CDI testing.
• Basic knowledge of coatings.
• Basic understanding of semiconductor processes (PVD, Etch, ALD, Diffusion, etc.).
• Basic understanding of OEM platforms and part knowledge (AMAT, LAM, ASM, etc.).

Physical Demands and Working Conditions

This role is performed primarily in a manufacturing and office environment.

• Ability to stoop, kneel, crouch, reach, walk, push, pull, and grasp.
• Ability to lift up to 25 lbs.
• Ability to move arms, hands, and fingers.
• Visual acuity required to perform assigned tasks.
• Ability to sit for sustained periods of time.
• Ability to talk on the phone and use a computer for extended periods.
• Required to wear personal protective equipment where applicable.
• Subject to noise levels, including moderate noise from equipment.