Principal Wafer Process Engineer

About the role

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon Vision Systems (RVS) is a world leader in the research, design and manufacturing of focal plane arrays and flight‑based vision systems. The Focal Plane Process Engineering department provides world‑class semiconductor and focal plane array manufacturing processes in support of production and development products. We have an opportunity for a talented Principal Process Engineer with a background in semiconductor manufacturing or thin film deposition. The candidate will work with and lead other process engineers, skilled technicians, and cross‑functional teams to develop strategies and processes for improving fab performance and output using our metrics.

Responsibilities

• Managing process development and improvement projects, including novel processing techniques, yield increase, throughput, and safety improvements
• Reviewing material in WIP, certifying operators, dispositioning out‑of‑flow material, and hands‑on processing of novel detector designs
• Providing Process Ownership of vacuum coating tools, etch tools, or lithography tools
• Developing requirements and qualification plans for new equipment procurements
• Working in a cleanroom environment with full cover‑all garments

Requirements

U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

Qualifications

• Typically requires a degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 8 years of prior relevant experience.
• Experience in Semiconductor Engineering, Manufacturing Engineering, and/or Process Engineering in Optics, Electro‑Optics or Microelectronics environment or Wafer Processing.

Skills

• Experience with wet etch, metal‑lift off, lithography, plasma cleaning, and associated semiconductor process equipment
• Experience with principles of vacuum system operations
• Experience with principles of photolithography
• Experience with etch (dry and wet)
• Experience with infrared detector technology and semiconductor physics
• Project management experience
• Knowledge of statistical process control and design of experiments
• Equipment and controls system experience

Benefits

• Medical, dental, vision, life insurance
• Short‑term and long‑term disability
• 401(k) match
• Flexible spending accounts
• Flexible work schedules
• Employee assistance program
• Employee Scholar Program
• Parental leave
• Paid time off and holidays
• Annual short‑term and/or long‑term incentive compensation programs (eligibility dependent on level and collective‑bargaining coverage)

Pay

The salary range for