Principal/Sr Principal PCB Producibility Engineer

About the role

Northrop Grumman is seeking a Principal PCB Producibility Engineer or a Senior Principal PCB Producibility Engineer to join our team based out of Linthicum, MD. This position requires a current/active DoD Secret clearance and involves providing engineering support for complex RF, Digital, Mixed Signal, and Power PCB designs.

Responsibilities

• Provide engineer support for the design of complex RF, Digital, Mixed Signal, and Power PCBs through all design phases.
• Advise on material selection, define stack-up, perform impedance calculations, and review routing rules.
• Conduct Design for Manufacturing (DFM) reviews to ensure PCB designs are producible and meet yield, cost, schedule targets.
• Review PCB documentation for fabrication concerns, including PCB drawings, parts lists, and electronic data.
• Serve as the liaison between internal design teams and PCB fabricators in obtaining preliminary quotes, addressing technical questions, reviewing revision notices, and investigating any PCB issues.
• Collaborate with cross-functional team—design teams, Global Supply Chain, PCB Category Management team, and PCB Fabricators to support PCB sourcing strategy and supplier readiness reviews.
• Aid in PCB layouts from component placement to routing, creating multi-layer board designs that meet signal integrity, power distribution, and EMC requirements.
• Build strong working relationships with internal and external PCB fabricators and PCB designers to understand capabilities, industry standards, and technology trends.

Requirements

• Bachelor’s Degree with 5 years of experience, master’s degree with 3 years of experience, Ph.D. with 1 years of experience in Science, Technology, Engineering, Mathematics or related technical fields; an additional 4 years of experience may be considered in lieu of a degree.
• U.S Citizenship is required.
• The ability to obtain/maintain an Active DoD Secret Clearance.
• Minimum of 5 years of PCB Producibility, PCB design or fabrication experience in a high volume or high complexity environment (digital, mixed signal, or RF).
• Minimum of 3 years of experience with automated DFM review tools (Valor NPI, Genesis, CAM350, and Polar).
• Minimum of 3 years of working knowledge of IPC 2221, IPC 6012 & 13, IPC 7351, and GD&T for PCB design.

Qualifications

• Bachelor’s Degree with 8 years of experience, master’s degree with 6 years of experience, Ph.D. with 4 years of experience in Science, Technology, Engineering, Mathematics or related technical fields; an additional 4 years of experience may be considered in lieu of a degree.
• U.S Citizenship is required.
• The ability to obtain/maintain an Active DoD Secret Clearance.
• Minimum of 8 years of PCB Producibility, PCB design or fabrication experience in a high volume or high complexity environment (digital, mixed signal, or RF).
• Minimum of 5 years of experience with automated DFM review tools (Valor NPI, Genesis200, CAM350, and Polar).
• Minimum of 5 years of working knowledge of IPC 2221, IPC 6012 & 13, IPC 7351, and GD&T for PCB design.

Skills

• Expert working knowledge of PCB design, IPC Standards, PCB fabrication processes and equipment.
• Familiarity with blind/buried vias, sequential lamination, and rigid-flex processes.
• Expert in PCB fabrication tools such as Valor NPI, Genesis200, CAM350 and Polar.
• Experience in developing design tools and scripts (Python, C/C++).
• Expert knowledge of Circuit Card Assembly manufacturing.
• Expert working knowledge of the Mentor Xpedition software suite.
• Experience with complex RF/microwave PCB design or high-speed digital design (≥5 Gbps).
• Experience with advanced PCB Technology such as High-Density Interconnect (HDI) and/or Ultra HDI material and processing.
• Experience working directly with advanced high complexity PCB fabricators.
• Willingness to travel to PCB Fabricators and Material Suppliers for technical collaboration.
• Familiarity with 3-D mechanical integration tools (SolidWorks, NX, Enovia).
• Flexibility and willingness to deal with diverse requirements and complex trade-offs, often outside of, or beyond, industry standards.
• Familiarity with Root Cause Correction Action (RCCA) methodology.
• Willingness to travel to PCB Fabricators or Material Suppliers for technical collaboration.
• Demonstrated success working in collaborative, fast-paced development teams.
• Ability to work in dynamic environment with cross-functional teams and support multiple projects simultaneously.
• Expert written and verbal communication; comfortable presenting technical concepts to cross-functional teams.

Benefits

Northrop Grumman offers a comprehensive benefits package, including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business. Employees may also be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives.

Pay

Primary Level Salary Range: $108,800.00 - $163,200.00 Secondary Level Salary Range: $135,800.00 - $203,600.00

Schedule

Travel: Yes, 10% of the Time