Principal Process Engineer, Die Bonding

About the role

As a Principal Process Engineer in Die Bonding within Micron Technology's Advanced Packaging Technology Development (APTD) department, you will drive the startup, development, and optimization of processes to enhance product quality and reliability. Your work will focus on process yield improvement, cost reduction, productivity enhancement, and risk management, as well as resolving manufacturing line problems. You will apply failure analysis, FMEA, 8D, or SPC/FDC methodologies to diagnose and resolve assembly process issues.

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies.
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives, implementing changes at the process step.
• Lead and participate in continuous yield improvement and cost reduction activities.
• Validate and fan out new process baselines, including new processes, tools, and/or materials for new product introduction.
• Manage, audit, and liaise with material suppliers to achieve quality, cost, and risk management objectives.
• Support SPC/FDC/RMS/APC and site-to-site portability.
• Support internal and external audits.

Requirements

• BS degree with a minimum of 8+ years of proven experience in Semiconductor Process Engineering.
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes.
• Skilled at designing valid tests and Design of Experiments (DOE).
• Excellent data collection, organization, and analysis skills, with proficiency in data analysis techniques/programs.
• Strong oral and written communication skills, with a keen attention to detail.
• Highly self-motivated with the ability to work independently, lead groups, and collaborate effectively.
• Understanding of project management.

Preferred Qualifications

• Master's or Doctorate degree in Engineering, Physics, or a related field.
• Experience in Die Bonding, including Fusion Bonding, Hybrid Bonding, Direct Bonding, or applications such as MEMS, Imager, Memory, or Heterogeneous Integration.
• Bonding experience at a Vendor, Research Institute, or Semiconductor Industry Equipment Supplier/Integrator.

Benefits

• A choice of medical, dental, and vision plans tailored to meet family healthcare needs and budget.
• Income protection programs for illness or injury, and paid family leave.
• Robust paid time-off program and paid holidays.

For additional information, refer to the Benefits Guide on Micron’s careers page.