Principal Packaging Design Integration Engineer

About the role

GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors.

The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplets and product modules.

Essential Responsibilities

• Drive SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Support new customer products with innovative design solutions and technology design rules.
• Drive design reviews with cross-functional teams.
• Drive cross-functional teams to resolve technical & yield concerns.
• Develop engineering team skills in packaging design constraints and considerations.
• Develop complex analysis models to predict manufacturability, cost, and quality.
• Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and markets to avoid costly re-designs.
• Foster discipline and qualification robustness through a consistent global design process.
• Drive CIP (Continuous improvement plans) to deliver organizational goals.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• PhD, or MS + 2 or more years of experience
• Experience in bringing packaged products from development into production.
• Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
• Advanced packaging design and layout expertise.
• Strong written and spoken English communication skills.

Preferred Qualifications

• Materials science, thermal, mechanical, simulation background.
• Experience with failure analysis, design of experiments, & packaging process integration.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.