Principal Mechanical Engineer

About the role

Join AMD's advanced packaging organization and help shape the mechanical architecture behind next-generation high-performance computing, AI, and semiconductor products. As a Principal Mechanical Engineer, you will lead the development of advanced package solutions spanning concept definition, mechanical design, simulation, qualification, and manufacturing ramp. This is a highly visible technical leadership role that offers the opportunity to influence product direction, solve complex packaging challenges, and work across silicon, packaging, thermal, reliability, and manufacturing teams to bring industry-leading technologies to market.

Responsibilities

• Perform and lead mechanical architecture and design strategy for advanced semiconductor packaging solutions.
• Perform and drive mechanical design, CAD development, and thermo-mechanical analysis from concept through production.
• Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
• Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.
• Establish design guidelines, mechanical specifications, and manufacturing requirements for advanced packaging technologies.

Requirements

• Hands-on expertise with ANSYS Mechanical, Creo, SolidWorks, and mechanical simulation workflows.
• Deep knowledge of thermo-mechanical reliability, stress analysis, warpage, and package-board interaction, including correlating simulations with DIC, shadow moiré, warpage metrology, strain gauges, thermal cycling data, cross-section analysis, acoustic microscopy, and failure analysis results.
• Advanced semiconductor packaging experience including flip-chip, chiplet, 2.5D/3D, interposer, or HBM-based architectures.
• Experience working with OSATs, foundries, substrate suppliers, and high-volume manufacturing partners.
• Strong understanding of package, substrate, PCB, and system-level mechanical integration.
• Proven technical leadership in complex semiconductor product development environments.

Qualifications

• MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field.
• Bachelor's degree and equivalent industry experience may be considered.

Skills

• Technical depth of a principal-level individual contributor.
• Judgment of a senior engineering leader.
• Hands-on capability to personally drive modeling, design reviews, supplier engagement, and problem resolution from concept through NPI, qualification, and production ramp.

Benefits

The benefits offered are described: AMD benefits at a glance.