Principal Image Sensor Development Engineer

Responsibilities

• Define the pixel architecture, layout/design, and corresponding process integration schemes.
• Design & layout of pixel test structures that will be required for pixel & process validation.
• Generate and evaluate process experiments for the optimization of Imager performance, quality, and manufacturability.
• Manage/support foundry level fabrication process of CMOS and CCD image sensor.
• Work closely with other engineers in design, probe, characterization, and production to optimize pixel design & process.
• Design and perform simulations of advanced CMOS, CCD and Lidar image sensors.
• Work with mixed signal and digital design team to develop innovative next generation imaging architectures and technology platforms.
• Lead/support the new product introduction (NPI) projects and the programs in CMOS and CCD image sensors for internal/external customers.
• Work closely with BD and engineering leadership to design/develop Imager technology to support the technology/product roadmap.
• Develop and win externally and internally funded research, development, and product design programs.
• Lead/participate in the development of technical proposals in support of new business.

Qualifications

• Bachelor's or Master's in Optics, Physics, Electrical Engineering or a related field required, PhD desirable.
• 15+ years’ experience in CMOS image sensor design (Defense, Commercial).
• Due to US Government requirements this position requires US Citizenship and the ability to obtain/maintain a security clearance.
• Proficiency with Cadence Design Systems IC design tools (layout, LVS, DRC, Schematic) in CMOS/CCD image sensor.
• Proficiency on TCAD process simulation tools or optics/optoelectronics.
• In depth knowledge and process integration experience in the state-of-art CMOS/CCD image senor is preferred. (i.e. Backside illuminated Senor, Global shutter, 3d Wafer stacking).
• Ability to understand as well as create circuit layouts and schematics and run DRC and LVS.
• Knowledge on how to build topological and electrical design rules understanding limitations of fab tools is plus.
• Ability to travel up to 10% of the time if necessary.

Pay

The salary range is: $133,520-$200,000. Salary ranges will vary and are based on several factors, including geographic location, market competitiveness and equity amongst internal employees in similar roles. Positions may also qualify for SRI's Pay for Outstanding Performance program or the annual Performance Based Compensation program.

Benefits

SRI also has a competitive benefits package, to view details please go to https://www.sri.com/resources/benefits/.