Principal Engineer Package Concept (Module)

About the role

At Infineon, we’re powering AI—from the grid to the core, today and in the future—delivering innovative solutions and redefining what’s possible in the world of data centers and beyond. Join our #PoweringAI teams and contribute to shaping the future of high-performance computing modules.

Responsibilities

• Define package concepts for AI power supply products with a focus on high-performance computing modules.
• Validate package concepts through simulation and hardware demonstrators in cooperation with Back End development, product development, and system architects.
• Align new ideas and concepts with Back End development (in-house + OSAT) and initiate assembly projects.
• Follow up and support package development projects until the final release of the product.
• Identify new development topics and incorporate them into the package roadmap.
• Support customers with package-specific questions.
• Stay up to date on package solutions through continuous market screening and competitor analysis.
• Identify business opportunities enabled by new technologies and concepts.

Requirements

• Technical background, e.g., degree in Physics or Electronics.
• 6 years of practical experience in assembly technologies with detailed knowledge of Back End processes, materials, and their dependencies.
• Background knowledge of laminate design, materials, and processes.
• Experience with SMT-related technologies.
• Experience with typical package design tools (e.g., AutoCAD, Cadence).
• Very good communication and presentation skills.

Pay

The wage range for this role in Andover, MA is a minimum of $156,900 per year to a maximum of $215,700 per year. All employees are also eligible to participate in an incentive plan.