Principal EDA R&D Engineer, Advanced Packaging

About the Role

You are an engineer at the intersection of package substrate design and EDA tool development, driving innovation by rethinking technical approaches. At Synopsys, you will lead R&D projects that advance package substrate design automation, influencing how the industry tackles these challenges. Your work will enable the next generation of semiconductor products, with your contributions shaping technical strategy and implementation.

Responsibilities

• Lead R&D projects that advance the state of the art in package substrate design automation, including auto-routing algorithms, DRC verification engines, power delivery network analysis, and design-for-manufacturing capabilities
• Drive technical direction for database models that enable schematic-driven layout workflows and support integration across the Synopsys packaging tool suite
• Develop and optimize EDA software using C++, Python, and TCL to address complex challenges in computational geometry, constraint solving, and physical design automation
• Collaborate directly with foundries and assembly and test companies to implement emerging substrate technologies, translating their Design Rule Manuals and manufacturing requirements into functional tooling
• Work with cross-functional teams to define collateral input/output formats, integrate analysis capabilities, and ensure database architectures support increasingly complex designs
• Provide technical guidance to engineers across the R&D organization, reviewing designs and implementations, and helping the team navigate technical tradeoffs
• Engage with customers in technical discussions at senior levels, representing Synopsys expertise in substrate design methodology and contributing to product direction

Impact

• Establish technical foundations for next-generation package substrate design tools that will be adopted across the semiconductor industry
• Enable customers to design substrates for advanced packaging technologies that current tooling cannot adequately support
• Reduce design cycle time by delivering automation that accurately models the constraints substrate engineers face in production environments
• Influence product roadmap by translating customer requirements and foundry technology trends into prioritized R&D initiatives
• Accelerate adoption of new packaging technologies by developing tools that integrate effectively with manufacturing flows and identify design-for-manufacturing issues early
• Shape industry best practices by collaborating with foundries and OSATs to develop and validate new design methodologies
• Strengthen the technical capabilities of the R&D organization through mentorship and knowledge transfer

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience in EDA or semiconductor design
• 10+ years of experience in EDA software development with focus on physical design automation, package design, or substrate design
• Deep technical expertise in package substrate physical design methodologies, including schematic-driven layout, auto-routing, design rule checking, and power delivery network analysis
• Strong programming proficiency in Python or TCL for tool integration and automation
• Demonstrated track record leading R&D projects that resulted in production software capabilities or significant architectural improvements
• Experience collaborating with foundries, OSATs, or substrate manufacturers on Design Rule Manuals, technology files, and manufacturing output formats such as ODB++
• Solid foundation in computational geometry and algorithm design for layout automation; experience with constraint-based routing or placement is highly valued

Skills

• Ability to engage in technical discussions with senior engineering leaders at semiconductor companies and clearly articulate complex technical tradeoffs and solution approaches
• Raise concerns when technical requirements conflict with sound architectural principles and articulate alternative approaches that address the underlying need
• Write well-structured code with attention to maintainability, documentation, and long-term supportability
• Effective working in environments where requirements are still evolving, particularly when new packaging technologies are under development and design rules are not yet finalized
• Guide less experienced engineers through technical challenges in a way that builds their capabilities and judgment
• Approach partnerships with foundries and OSATs as collaborative technical relationships, recognizing that effective solutions require understanding their constraints and processes

Benefits

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings.