Principal Analog Mixed-Signal IC Design Engineer (Data Converters) - TeraWave

About the role

Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide.

Responsibilities

• Lead the architecture, development and integration of advanced high-speed data converters (ADCs and DACs), as well as other fundamental analog/mixed-signal functions in advanced FinFET CMOS technologies, focusing on performance optimization, power and trade-off analysis.
• Develop high-level behavioral models in MATLAB, Simulink, or SystemVerilog-AMS to validate system performance before circuit implementation.
• Utilize full proficiency in Spectre and AMS flows to develop high-performance mixed-signal circuits and systems.
• Collaborate with system architects to define block-level performance and interface requirements based on system specifications, ensuring seamless integration into RF payloads and terminals.
• Oversee layout, top-level integration, floorplanning, and verification of the overall design for successful tape-out cycle.
• Work closely with validation and product engineers to develop test plans, facilitate bring-up, optimize performance, and ensure reliable & high-yield production cycles.
• Investigate and implement fundamental analog building blocks to enhance overall circuit performance and mentor junior engineers for best design practices in analog domain.

Requirements

• Bachelor's degree in Electrical Engineering, or related technical discipline.
• Extensive hands-on experience in the design of high-speed data converters in advanced FinFET technology nodes.
• Proficiency in the design of SerDes for high-speed data converters such as DACs.
• Familiarity with analog-to-digital conversion architectures and techniques such as SAR, pipeline, TDC, delta-sigma, interleaved sampling, RF, and sub-sampling.
• Understanding of digital calibration algorithms for impairments of said architectures and techniques.
• Proficiency in mixed-mode and analog/RF modeling, simulation, and verification methodologies using toolsets such as MATLAB, Spectre, SystemVerilog, and AMS.
• Deep understanding of Electromigration and layout-dependent effects on circuit performance, namely in advanced FinFET technologies.
• Extensive experience in silicon characterization and debugging.
• Strong background in fundamental analog/RF building blocks, including amplifiers, filters, oscillators, reference generation and LDOs.
• Chip lead experience.
• Strong communication skills.

Qualifications

• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Preferred Qualifications

• MS or PhD in Electrical Engineering with 15+ years of relevant experience.
• Familiarity with RF design concepts and metrics such as noise figure, intercept points, line-up analysis, etc.
• Mixed-signal architecture.
• Fundamental understanding of device physics for process selection and performance optimization.
• Familiarity with chip-level ESD protection design and verification.
• Familiarity with digital design, digital verification, and SystemVerilog modeling.

Benefits

• Medical, dental, vision, basic and supplemental life insurance.
• Paid parental leave.
• Short and long-term disability.
• 401(k) with a company match of up to 5%.
• Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week).
• Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.