Platform - Digital Systems Engineer

Key Responsibilities

• Lead the definition of long-term technical direction for select digital product lines on Teradyne’s flagship UltraFLEXplus tester by analyzing semiconductor, packaging, interface, and test technology trends.
• Drive critical architecture trade-offs and technical recommendations for complex digital instrumentation, balancing performance, scalability, signal integrity, cost, risk, schedule, and long-term extensibility.
• Represent Teradyne in external conferences, standards discussions, and industry forums to gather technical VOC, benchmark emerging technologies, and identify opportunities for differentiated test capability.
• Build credibility with customers, device architects, product leaders, and internal engineering teams as a senior technical leader who identifies inflection points where Teradyne can create competitive advantage.

About the Role

The Platform-Digital Systems Engineering position is a highly visible technical leadership role responsible for defining customer-facing test solutions and shaping the architecture of next-generation digital instrumentation for ATE systems.

Requirements

• 10+ years of engineering experience, including significant experience as a senior individual contributor, system architect, principal engineer, or technical lead for complex hardware/software systems.
• Proven ability to lead technical direction across engineering teams, customers, product leaders, and executives through clear reasoning, strong technical judgment, and effective communication.
• Strong understanding of digital DFT, semiconductor test strategies, ATE architectures, and production test requirements.
• Deep digital hardware/software systems knowledge, with demonstrated ownership of architecture-level trade-offs across performance, signal integrity, timing, scalability, diagnostics, cost, manufacturability, and product extensibility.
• Demonstrated curiosity and fluency in emerging semiconductor technologies such as high-speed serial interfaces, advanced memory, chiplets, advanced packaging, and AI/HPC device trends.
• Track record of leading ambiguous, cross-disciplinary technical problem solving and mentoring engineers through technical guidance, design reviews, and architecture decision-making.
• Strong teamwork skills.
• Ability to travel domestically and internationally up to 10-20% of the time.

Qualifications

We are an equal-opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status. We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform crucial job functions, and to receive other benefits and privileges of employment.