Physical Design Engineering, VP

Key Responsibilities

• Lead end-to-end physical design execution for complex multi-die switching products with UCIe and UALink connectivity
• Drive chip-level floorplanning, power planning, placement, routing, and timing closure for advanced node designs
• Establish physical design methodologies and best practices for interposer-based chiplet architectures and die-to-die interfaces
• Own physical design quality metrics including timing, power, area, and manufacturability across multiple concurrent projects
• Partner with architecture and digital design teams to influence RTL for physical implementation success
• Collaborate with packaging engineering on advanced 2.5D/3D integration strategies and interposer design
• Work closely with silicon engineering and DFT teams to ensure robust designs through tapeout and bring-up
• Drive resolution of critical timing, power, and signal integrity challenges in high-speed SerDes and switching fabrics

Basic Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
• 15+ years of experience in physical design and implementation of complex SoCs or ASICs
• Proven track record leading physical design teams and delivering multiple successful tapeouts in advanced process nodes (7nm or below)
• Deep expertise in chiplet architectures, interposer design, and die-to-die interface implementation
• Strong understanding of advanced packaging technologies including 2.5D and 3D integration
• Expert-level knowledge of physical design flows, timing closure, power optimization, and signoff methodologies
• Experience managing and scaling engineering teams of 20+ people

Preferred Qualifications

• Master's degree or PhD in Electrical Engineering or related field
• Experience with UCIe, PCIe Gen 6/7, or other high-speed SerDes physical implementation
• Background in AI/ML infrastructure, networking ASICs, or high-performance switching products
• Deep expertise with Cadence and/or Synopsys physical design tools and flows
• Experience with advanced DFT integration and design for manufacturability (DFM)
• Track record of innovation in physical design methodologies and automation
• Strong leadership and communication skills with ability to influence across organizations