Photolithography Process Development Engineer (51118)
for section headings. Do not repeat job title. Do not include Job ID etc. Remove boilerplate like EEO, accommodation, etc. Also remove navigation/legal etc. We must preserve all substantive info.
We need to decide sections: About the role (maybe summary), Responsibilities (Essential Functions), Requirements (Qualifications + Knowledge, Skills, And Abilities), Benefits? Not given explicitly besides bonus target + benefits mentioned but not detailed. The posting says "annual rate ... + bonus target + benefits." That's mention of benefits but not specifics. Should we include Benefits section? The rule: include a section ONLY when posting has real, specific content for it — never emit heading followed by filler/placeholder text. "bonus target + benefits" is vague but still mentions benefits exist. It's not specific detail. Might be considered not specific enough. Safer to omit Benefits section unless we have specifics. Pay section: we have annual rate range. That's specific enough. So include Pay section.
Schedule: we have working conditions: primarily office environment Monday thru Friday, schedule may be altered, may travel. That's schedule info. So include Schedule section.
We also have Working Conditions details (environment, hazards). Could be part of Schedule or separate? The instruction: Use headings for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule). They gave examples but we can choose. We have info that fits About the role (summary), Responsibilities (Essential Functions), Requirements (Qualifications + Knowledge, Skills, And Abilities), Pay, Schedule. Could also include Working Conditions as part of Schedule or separate but not in list. Probably combine working conditions into Schedule section (since schedule and working conditions both relate to work environment). But we have separate details: location, environment, hazards, physical demands. Could be a "Working Conditions" section but not in examples; but we can still use heading if content exists. The instruction says use for section headings (e.g. About the role, Responsibilities, Requirements, Qualifications, Skills, Benefits, Pay, Schedule). It doesn't forbid other headings, but suggests those as examples. Safer to stick to those headings. So we can put working conditions details under Schedule or maybe under About the role. But schedule heading expects schedule info; we can include both schedule and working conditions under Schedule heading.
Thus sections:
About the role
-> summary paragraph.
Responsibilities
-> essential functions list.
Requirements
-> combine minimum qualifications and knowledge, skills, abilities into a list? Could split into Qualifications and Skills but we have only one Requirements heading allowed? The examples include Qualifications, Skills separate. But we can include both if we have content. Better to follow examples: Use Qualifications heading for minimum qualifications, Skills heading for knowledge, skills, abilities. But we need to decide if we have enough content for each. We have minimum qualifications bullet list; we have knowledge, skills, abilities list. So we can have two sections: Qualifications and Skills.
Thus sections: About the role, Responsibilities, Qualifications, Skills, Pay, Schedule.
Check each for substantive content.
About the role: summary paragraph (Under the direction...). That's substantive.
Responsibilities: essential functions list (multiple bullet points). Good.
Qualifications: minimum qualifications list (Bachelor’s degree..., PhD preferred, 1-3 years experience..., experience in wafer fab..., SPC, MS Office). Good.
Skills: knowledge, skills, abilities list (knowledge of semiconductor/HDD industry principles, wafer fab processing, TMR/PMR processes, wafer manufacturing principles, ability to use MS Office, SPC, communication, teamwork, safety compliance, organizational/time management, problem-solving, flexibility). Good.
Pay: annual rate range $121,000-$160,000 + bonus target + benefits. That's specific enough.
Schedule: location Milpitas, California; works primarily in office environment Monday thru Friday; schedule may be altered; may travel; may work in class 100 ESD sensitive wafer fab; adhere to safety/dress standards; may be exposed to hazardous chemicals, fumes, vapors, excessive noise; stands/walks; fine grasping; bends/twists; operates computer/keyboard/telephone; may occasionally lift up to 10 pounds. That's substantive.
We must not include boilerplate: EEO, accommodation, etc. Also remove "FLSA STATUS: EXEMPT", "REPORTS TO: DIRECTOR OR MANAGER, PHOTOLITHOGRAPY PROCESS OR MANUFACTURING ENGINEER". Those are metadata; we can fold minor metadata into a short
About the role
-> summary paragraph.Responsibilities
-> essential functions list.Requirements
-> combine minimum qualifications and knowledge, skills, abilities into a list? Could split into Qualifications and Skills but we have only one Requirements heading allowed? The examples include Qualifications, Skills separate. But we can include both if we have content. Better to follow examples: Use Qualifications heading for minimum qualifications, Skills heading for knowledge, skills, abilities. But we need to decide if we have enough content for each. We have minimum qualifications bullet list; we have knowledge, skills, abilities list. So we can have two sections: Qualifications and Skills. Thus sections: About the role, Responsibilities, Qualifications, Skills, Pay, Schedule. Check each for substantive content. About the role: summary paragraph (Under the direction...). That's substantive. Responsibilities: essential functions list (multiple bullet points). Good. Qualifications: minimum qualifications list (Bachelor’s degree..., PhD preferred, 1-3 years experience..., experience in wafer fab..., SPC, MS Office). Good. Skills: knowledge, skills, abilities list (knowledge of semiconductor/HDD industry principles, wafer fab processing, TMR/PMR processes, wafer manufacturing principles, ability to use MS Office, SPC, communication, teamwork, safety compliance, organizational/time management, problem-solving, flexibility). Good. Pay: annual rate range $121,000-$160,000 + bonus target + benefits. That's specific enough. Schedule: location Milpitas, California; works primarily in office environment Monday thru Friday; schedule may be altered; may travel; may work in class 100 ESD sensitive wafer fab; adhere to safety/dress standards; may be exposed to hazardous chemicals, fumes, vapors, excessive noise; stands/walks; fine grasping; bends/twists; operates computer/keyboard/telephone; may occasionally lift up to 10 pounds. That's substantive. We must not include boilerplate: EEO, accommodation, etc. Also remove "FLSA STATUS: EXEMPT", "REPORTS TO: DIRECTOR OR MANAGER, PHOTOLITHOGRAPY PROCESS OR MANUFACTURING ENGINEER". Those are metadata; we can fold minor metadata into a shortor drop it. The instruction: "do NOT put Job ID / requisition numbers as headings — fold minor metadata into a short
or drop it." So we could include a short paragraph for FLSA status and reports to? Probably drop them as they are minor metadata. The location is important; we included in Schedule. We must not repeat job title as heading. Good. We must not include navigation/legal/EEO etc. Remove the EEO paragraph and accommodation request. We must preserve all substantive information; ensure we didn't lose any. Let's extract the summary: "Under the direction of the department Director, the Photolithography Process Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California." We can keep that. Essential Functions list: bullet points: - Develops and implements new photolithography processes for next generation magnetic recording heads - Implements new process control schemes or methodologies which ensure product manufacturability - Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap - Adheres to appropriate timeline for introducing new processes into the manufacturing line - Partners with other groups and departments, including process and product engineering to develop and deliver products and programs - Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition - Adheres to all safety policies and procedures as required - Performs other duties of a similar nature or level* We should keep the asterisk? Probably keep as part of text. Qualifications (minimum): - Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferred - One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process Development - Experience working in a wafer fab manufacturing environment - Experience with Statistical Process Control (SPC) - Proficient in the use of Microsoft Office Applications Knowledge, Skills, And Abilities list: - Knowledge of semiconductor or HDD industry principles, practices, and techniques - Knowledge of wafer fabrication processing techniques, including process development and integration practices - Knowledge of TMR and PMR processes and applications - Knowledge of wafer manufacturing principles, processes, and equipment - Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations - Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action - Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management - Able to work productively and collaboratively with all levels of employees and management - Able to comply with all safety policies and procedures - Demonstrated organizational and time management skills - Demonstrated problem-solving and trouble shooting skills - Flexible and able to prioritize Pay: The annual rate for this full-time position is between $121,000.00-$160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically. We can keep that as a paragraph. Schedule/Working Conditions: location Milpitas, California; works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from site-to-site as needed. May also work in a class 100 ESD sensitive wafer fab manufacturing facility; adheres to required safety and dress standards. May be exposed to hazardous chemicals, fumes, or vapors and excessive noise from time-to-time while in the wafer manufacturing facility; stands and walks; performs various fine grasping movements, bends, and twists; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 10 pounds. We can combine location and schedule. Now produce HTML fragment with
headings and - for lists,
for prose.
We need to ensure we don't include any extra text outside HTML.
Let's craft:
About the role
Under the direction of the department Director, the Photolithography Process Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
Responsibilities
- Develops and implements new photolithography processes for next generation magnetic recording heads
- Implements new process control schemes or methodologies which ensure product manufacturability
- Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
- Adheres to appropriate timeline for introducing new processes into the manufacturing line
- Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
- Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
- Adheres to all safety policies and procedures as required
- Performs other duties of a similar nature or level
Qualifications
- Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferred
- One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process Development
- Experience working in a wafer fab manufacturing environment
- Experience with Statistical Process Control (SPC)
- Proficient in the use of Microsoft Office Applications
Skills
- Knowledge of semiconductor or HDD industry principles, practices, and techniques
- Knowledge of wafer fabrication processing techniques, including process development and integration practices
- Knowledge of TMR and PMR processes and applications
- Knowledge of wafer manufacturing principles, processes, and equipment
- Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
- Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
- Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
- Able to work productively and collaboratively with all levels of employees and management
- Able to
for prose. We need to ensure we don't include any extra text outside HTML. Let's craft:
About the role
Under the direction of the department Director, the Photolithography Process Development Engineer is responsible for the developing and implementing new photolithography processes for next generation magnetic recording heads, including implementing new photolithography processes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; research, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.
Responsibilities
- Develops and implements new photolithography processes for next generation magnetic recording heads
- Implements new process control schemes or methodologies which ensure product manufacturability
- Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
- Adheres to appropriate timeline for introducing new processes into the manufacturing line
- Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
- Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
- Adheres to all safety policies and procedures as required
- Performs other duties of a similar nature or level
Qualifications
- Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; PhD preferred
- One to three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry in Process Development
- Experience working in a wafer fab manufacturing environment
- Experience with Statistical Process Control (SPC)
- Proficient in the use of Microsoft Office Applications
Skills
- Knowledge of semiconductor or HDD industry principles, practices, and techniques
- Knowledge of wafer fabrication processing techniques, including process development and integration practices
- Knowledge of TMR and PMR processes and applications
- Knowledge of wafer manufacturing principles, processes, and equipment
- Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
- Knowledge and ability to use Statistical Process Control (SPC) to analyze data, create reports, present findings, and recommend appropriate action
- Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
- Able to work productively and collaboratively with all levels of employees and management
- Able to