PCB Layout Engineer

About the role

Own the board-level physical design that turns our accelerator silicon into systems. You'll take high-speed, high-power designs from placement through fabrication release — defining stackups, escaping large fine-pitch BGAs, routing multi-hundred-amp power delivery, and holding the constraint discipline that lets a channel close margin in the lab and not just in simulation. You'll work at the seam where the package meets the system, partnering with signal and power integrity, packaging, and hardware systems, and directly with the fabrication and assembly partners who build what you release. When a board comes back and something doesn't behave, you're one of the people who knows why.

Responsibilities

• Own board-level physical design for the systems our AI accelerators ship in: stackup and impedance definition, placement, high-speed routing, and fabrication and assembly release packages
• Own high-current power delivery layout and large fine-pitch BGA escape for advanced accelerator packages
• Drive DFM/DFA with PCB fabrication and contract manufacturing partners, and support board bring-up and debug
• Use and develop AI-assisted tool flows to accelerate layout, review, and design-rule checking

Requirements

• Exceptional abilities in constraint-driven layout of complex high-speed, high-current boards: controlled impedance and stackup definition, return-path and crosstalk management, length and skew matching, and via optimization
• 8+ years of PCB layout experience on server, networking, or accelerator-class systems at high layer counts
• Hands-on with industry-standard layout tools (Cadence Allegro, Siemens Xpedition, Altium, or equivalent) and release formats (Gerber, ODB++, IPC-2581)
• Demonstrated ability to work closely with signal-integrity, power-integrity, packaging, and hardware systems teams to implement and close complex constraint sets across package and board

Qualifications (Optional)

• 2.5D / 3D and multi-die package interfaces (CoWoS, EMIB, chiplets, HBM)
• Rigid-flex or backplane design
• CAD automation scripting
• IPC CID / CID+
• Overseas PCB fabrication and PCBA partner management

Pay

California pay range: $200,000 USD - $275,000 USD

Benefits

• Equity grant per company guidelines
• Medical, dental, and vision coverage
• 401(k) retirement plan
• Standard paid time off (PTO)

Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and welcomes applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.