Packaging Integration Engineer (2027 New College Graduate)

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world, with a talented, global team focused on security, longevity, and sustainability.

About the role

GlobalFoundries (GF) is seeking a new college graduate to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design, with an emphasis on product and module performance, reliability, packaging design rules, materials selection, and electrical, photonic, and thermal requirements for chiplet and product modules.

Responsibilities

• Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
• Participate in cross-functional design reviews and use engineering analysis to help resolve technical, manufacturability, reliability, and yield concerns for new customer products.
• Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
• Contribute to qualification robustness and continuous improvement plans by applying consistent design processes, tracking requirements, and supporting product development from concept through production readiness.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Requirements

• Graduating with a Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering, or a related field from an accredited degree program.
• Minimum overall 3.0 GPA and proven good academic standing.
• English language fluency (written & verbal).
• Up to 10% travel.

Preferred Qualifications

• Prior related internship or co-op experience.
• Demonstrated leadership experience in the workplace, school projects, competitions, etc.
• Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
• Project management skills, including the ability to innovate and execute solutions that matter and navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.
• Coursework, research, internship, or project experience in advanced packaging, chip-package co-design, photonics, thermal or mechanical analysis, materials, reliability, or packaging process integration.

Pay

Expected salary range: $58,400.00 – $100,800.00. The exact salary will be determined based on qualifications, experience, and location.