Packaging Engineer

Overview

Microsoft's Quantum Systems organization is a multidisciplinary organization advancing cutting-edge quantum technologies to address some of the world's most complex challenges. We are seeking a Packaging Engineer with a focus on hands-on process and materials development. This is a unique opportunity to shape the future of quantum systems in a dynamic, mission-driven environment. At Microsoft Quantum, we aim to empower science and scientists to solve the world's biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind's currently unsolvable problems.

Responsibilities

• End-to-end quantum device package assembly and build execution
• Manufacturing equipment operation, training, and process optimization
• Packaging configuration documentation and records maintenance
• Analysis and problem-solving involving assembly process failures
• Reliability testing, adhesive characterization, and process development
• Develop and maintain robust assembly processes for quantum devices
• Support general laboratory organization and upkeep
• Work in teams or independently as required
• Embody our Culture and Values

Required Qualifications

• Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR equivalent experience
• Ability to meet Microsoft, customer and/or government security screening requirements, including Microsoft Cloud Background Check upon hire/transfer and every two years thereafter
• Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C.1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable
• Ability to leverage AI tools to drive innovation and efficiency (e.g., performance modeling and analysis, research gathering, day to day task automation)
• Evaluate agentic solutions with measurable metrics and human in the loop safeguards following Microsoft Responsible AI requirements for generative AI

Preferred Qualifications

• Master's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field AND 2+ years technical engineering experience OR equivalent experience
• Hands-on experience with industry standard packaging and assembly processes (wire bonding, die bonding, adhesive dispense)
• Hands-on experience with industry standard packaging and assembly materials (PCBs, adhesives, solder)
• Ability to work in a team and effectively communicate to meet deadlines and deliver results
• 2+ years of hands-on experience with packaging of complex (optomechanical, MEMS, microwave) devices

Pay

The typical base pay range for this role across the U.S. is USD $85,400 - $168,100 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $111,100 - $183,700 per year. Certain roles may be eligible for benefits and other compensation.