Packaging (Electroplating) Account Technologist

Key Responsibilities

• Manage the install Base and new products Application Performance to drive Customer Satisfaction & Identify Business Risks.
• Manage the definition and implementation of processes and applications to meet customer's current and future requirements for productivity and leading edge technology, using Applied Materials products.
• Guides technology development and transfer, integrates customer technology requirements into internal product roadmap.
• Solves complex field process issues utilizing systematic troubleshooting methodology. Create a mechanism to communicate issues and track progress. Use sound statistical techniques like DOEs (Design of Experiment) to quickly determine root cause and action plans.
• Communicates learnings from this portion to rest-of-world to strengthen the product packages.
• Responsible for customer demos, including defining demo conditions, wafer processing and analyzing results.
• Aids account teams in managing the customer account to enhance customer satisfaction and increase AMAT’s product and technical reputation.
• Works with business unit in technology development and transfer to customers including customized process development.
• Plans unit process sequence (Electroplating) based on customer requirements. Negotiates process specifications with customers.
• Takes ownership of delivering the required solution to the customers that meets specification.
• Takes the lead in positioning new technologies to customers utilizing technical information from divisions.
• Builds strategic partnerships to evaluate new and emerging technologies and oversee joint development activities or beta-site testing programs.
• Makes management level presentations.
• Participates in defining product strategy, identifies gaps. Provides feedback on process and hardware improvements to meet customer roadmap requirements.
• Keeps abreast of new developments that directly impact unit processes.

Preferred Qualifications

• Experience in Electroplating, Planarization Plating and Clean (PPC)
• Experience in semiconductor process integration, multiple layer related process
• Proficiency in both Korean and English