Packaging Design Integration Engineer (2026 New College Graduate)

About the Role

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF’s Photonix platform and advanced 2.5D/3D packaging technologies.

Responsibilities

• Support packaging design integration activities for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.
• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
• Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.
• Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.
• Support development and documentation of design guidelines, technical reports, and presentation materials.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.
• Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.

Requirements

• Graduating with a Bachelor’s, Master’s, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.
• Demonstrated analytical and problem-solving skills.
• Experience analyzing experimental, simulation, or engineering data.
• Ability to work effectively within cross-functional teams.
• Language Fluency - English (Written & Verbal).

Preferred Qualifications

• Prior related internship, co-op, research, or academic project experience in advanced packaging, silicon photonics, chip package interaction, thermal/mechanical/electrical/optical design, reliability engineering, or process integration.
• Familiarity with design or modeling tools such as HFSS, Zemax/Zmax, FloTHERM, finite element analysis, electrical simulation, optical simulation, or related engineering software.
• Knowledge of advanced packaging technologies including flip-chip, chiplets, 2.5D, or 3D integration.
• Familiarity with Design of Experiments (DOE), engineering statistics, or data analysis methods.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, research groups, or student organizations.
• Project management skills, i.e. the ability to innovate and execute solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning and organizational skills.

Pay

Expected Salary Range $85,000.00 - $146,000.00. The exact Salary will be determined based on qualifications, experience and location.