Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal

Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F Key Responsibilities Develop detailed thermal models for 2.5D/3D IC packages, chiplets, and multi-die systems; perform steady-state and transient thermal analysis with hotspot identificationExecute power integrity (PI) and IR drop analysis; optimize power distribution networks (PDN) and power delivery architecturesConduct electromigration (EM) and reliability analysis for interconnects, bumps, TSVs, and redistribution layers (RDL)Develop chip-package co-simulation workflows using industry-standard EDA tools (ANSYS RedHawkSC, RHSC-ET, SIwave, Cadence Sigrity/Clarity)Create hierarchical compact macro models (CMM) and reduced-order thermal models for earlystage design optimizationAutomate simulation workflows using Python, TCL, and Shell scripting; build design space exploration toolsCollaborate with silicon design, package design, and manufacturing teams on design-for-reliability (DFR) initiativesSupport customer engagements with technical analysis and present findings to stakeholders Education Minimum Qualifications: PhD in Electrical/Mechanical Engineering, or related field with focus on thermal management, power delivery, or electronic packaging (Master's with 5+ years experience considered)Strong academic background in power integrity, signal integrity, and thermal management for advanced packaging Technical Skills Expert proficiency in: ANSYS RedHawk-SC, RHSC Electrothermal, Totem, PathFinder, SIwave, HFSS, Q3D; Cadence Voltus, Sigrity, Clarity; Synopsys RedHawk Fusion, PrimeTime, ICC2Experience with physical design tools (Cadence Innovus, Synopsys ICC2, Siemens Calibre) and RTLto-GDSII flowsStrong programming/scripting: Python, C/C++, Tcl, Shell (bash); Verilog/VHDL/SystemVerilog for verificationKnowledge of advanced packaging: 2.5D/3D ICs (CoWoS, InFO, EMIB), chiplets, TSVs, interposers, FOWLP, RDL design Domain Expertise Deep understanding of EM/IR analysis, power integrity, thermal physics, and electrothermal cosimulationExpertise in heat transfer principles (conduction, convection, radiation), thermal material properties, and CTE mismatchKnowledge of chiplet standards (UCIe and BoW), die-to-die interfaces, and wafer-scale integrationHands-on experience with semiconductor package thermal/electrical analysis and tape-outs Ideal Qualifications Familiarity with machine learning applications in EDA and design optimizationExperience with HPC, AI/ML accelerator packaging, or co-packaged optics (CPO)Background in reliability testing (thermal cycling, HTOL, THB) and measurement correlation What We Are Looking For Strong analytical mindset with expertise across multiple physics domains (thermal, electrical, mechanical)Excellent communication skills to present complex technical concepts to diverse audiencesCross-functional collaboration abilities to work with silicon, package, product, and manufacturing teamsSelf-motivated professional who thrives in fast-paced environments with minimal supervisionContinuous learner staying current with emerging technologies; innovation-driven with creative problem-solvingResults-oriented engineer delivering high-quality work to enable product milestones on schedule We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.