Jobs · Engineering · Arizona

Advanced Packaging SI/PI Senior Staff Engineer

Marvell Technology · Chandler, AZ · 3 wk ago
EngineeringFull-time

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

The Marvell Advanced Packaging team supports customers with package designs that meet challenging electrical requirements. They work on high-speed signaling and challenging power delivery networks, requiring complex and custom solutions to meet constantly advancing application needs. Many of the new designs involve multi-chip and multiple component configurations with high-speed IP requirements. Additionally, they are advancing Marvell's expertise in 3D packaging, Co-packaged optics, and cutting-edge substrate materials.

What You Can Expect

  • Evaluating package or PCB designs for challenging electrical requirements
  • Closing interaction with physical designers and IP teams to optimize electrical performance
  • Executing simulation tasks for signal and power integrity sign-off

Skills Needed To Be Successful In This Role

  • Understanding of signal integrity and power integrity concepts and fundamentals
  • Experience with simulation and analysis tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
  • Working knowledge of circuit extractions and simulation techniques
  • Strong communication, presentation, and documentation skills
  • Proven track record of technical leadership in the organization
  • Experience with developing systems with high-speed interfaces like HBM, DDR, SERDES, and Die2Die interfaces
  • Familiarity with semiconductor packaging technologies, materials, and substrate or PCB design

What We're Looking For

  • A bachelor's degree in electrical engineering or related fields and 5+ years of related professional experience in package or PCB design
  • Or a master's degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery with 3+ years of experience

Expected Base Pay Range (USD)

$142,700 - $211,230, $ per annum

Additional Compensation And Benefit Elements

  • Employee stock purchase plan with a 2-year look back
  • Family support programs to help balance work and home life
  • Robust mental health resources to prioritize emotional well-being
  • Recognition and service awards to celebrate contributions and milestones

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews. These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

Export Control Compliance

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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