Optoelectronic IC Package Design Director

Responsibilities

• Own and drive advanced package selection, new product BGA configuration, and package structure
• Own and manage package development schedules
• Responsible for package layout, SI/PI optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out
• Simulate and optimize signal and power integrity and RF performance of the package design
• Interface and work with CMs and vendors for sourcing existing designs and future product development

Requirements

• BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
• 10+ years hands on experience with IC package design experience

Nice to Have

• Substrate design experience for RF, digital, high speed and mixed signal designs
• Thorough understanding of signal and power integrity fundamentals
• Experience with Advanced Package Designer (APD) and SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
• Experience in SI/PI and EM simulation tools such as SIWave and HFSS
• Experience in package design electrical review, SI/PI analysis
• Experience in package design for manufacturing reviews
• Experience in thermal and mechanical design
• Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers

Qualifications

The Must Haves:

• BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus)
• 10+ years hands on experience with IC package design experience

Skills

The Nice To Haves:

• Substrate design experience for RF, digital, high speed and mixed signal designs
• Thorough understanding of signal and power integrity fundamentals
• Experience with Advanced Package Designer (APD) and SIP and/or Xpedition Package Designer (XPD) tools (Cadence highly preferred)
• Experience in SI/PI and EM simulation tools such as SIWave and HFSS
• Experience in package design electrical review, SI/PI analysis
• Experience in package design for manufacturing reviews
• Experience in thermal and mechanical design
• Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers

Benefits

Pay Range: The annual salary range for this position is $235,600 - $376,400.

Ciena offers a comprehensive benefits package, including medical, dental, and vision plans, participation in 401(K) (USA) & DCPP (Canada) with company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company-paid holidays, paid sick leave, and vacation time.

We also comply with all applicable laws regarding Paid Family Leave and other leaves of absence.

Ciena is an Equal Opportunity Employer, including disability and protected veteran status.