Mechanical Engineering, Principal

Principal Job Description

Support new package design and development by working with a team of engineers and designers. Responsible for all mechanical aspects of new and legacy designs. Devices range from single chip packages to subsystem modules. Key aspects of the role include:

• Ownership of the compliance of designs to meet mechanical requirements
• Interaction with customers and ability to negotiate requirements where conflicts may occur
• Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in-line with expectations across the company
• Mechanical analyses including but not limited to structural, thermal and reliability
• Design of assembly and test fixtures
• Understanding of machining best practice and GD&T tolerancing
• Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities
• Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking, etc.
• Ability to work in fast paced environment with small and large teams with little-to-no supervision

Qualifications

• Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role
• Experience with IC packaging, system and subsystem mechanical design and analysis
• The ideal candidate will have experience with RF and millimeter wave types of products
• Key capabilities of an ideal candidate are:
• Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach
• Experience with aluminum, copper and other alloys for use in packaging and thermal transfer
• Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums
• Experience with metal plating standards and requirements
• Experience in reliability, failure analysis, and quality assurance in advanced package and process development
• Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]
• Intimate knowledge of structural analysis using 3D CAD tools as well as first principles
• Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles
• Demonstrated ability to lead independent process development
• Ability to provide suppliers direction by working with design, assembly, and quality organizations
• Familiar with finite element analyses (FEA) required and computational fluid dynamics (CFD) desired
• Familiar solving steady state and dynamic thermal problems
• Experience using: Solidworks, AutoCad, and PCB layout viewers is ideal
• Strong problem solving skills along with good communication, team work, and interpersonal skills
• Experience in critical thinking and presentation skills
• Experience with supplier and program management roles
• Ability to balance and prioritize multiple programs and needs simultaneously
• Fluent communicator in the English language

Pay and Schedule

The Salary Range for this position is $97,902– $166,698 per hour. Actual salary offered to candidates will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.

Benefits

This position offers a comprehensive benefits package including but not limited to: Health, dental, and vision insurance. Employer-sponsored 401(k) plan. Paid time off. Professional development opportunities.