Manufacturing Technician - Wire Bonding (Manual Wedge)

About the role

Microchip Technology Inc. is seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes.

Responsibilities

• Operate wire bonding machines and equipment with precision and according to standard operating procedures.
• Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
• Inspect and test wire bonds to ensure quality and compliance with specifications.
• Perform wire bond equipment setup including tool changes, wire changes, and troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
• Maintain accurate records of production data, process adjustments, and equipment maintenance.
• Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
• Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
• Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
• Absorb and assist in the training of new technicians and support staff as required.
• Perform other tasks and assist with various projects as needed.

Requirements/Qualifications

• High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
• Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
• Proficiency with automated wire bonding machinery and manual wire bonding techniques.
• Strong understanding of microelectronics and the ability to work with delicate components.
• Ability to read and interpret technical drawings and process specifications.
• Ability to navigate and utilize a computer to perform job activities.
• Excellent manual dexterity and hand-eye coordination.
• Excellent visual capability to work with extremely small die, without magnification devices.
• Experience using tweezers, vacuum pencils, etc.
• Strong problem-solving skills and attention to detail.
• Ability to work in a fast-paced, team-oriented environment.
• Good communication skills, both written and verbal.

Benefits

Find more information about all our benefits at the link below: Benefits of working at Microchip