Manufacturing Technician (DL) - Wirebonding

About the role

We are seeking a Manufacturing Technician to join our team in a cleanroom environment. This role involves processing wafers, dies, and packaged components, performing assembly and inspection operations, and maintaining accurate production records.

Responsibilities

• Follow detailed written instructions and perform a variety of assembly and inspection operations
• Maintain accurate production records
• Interface with multiple departments and demonstrate strong attention to detail, manual dexterity, and effective communication skills
• Use microscopes extensively to inspect and manipulate small components
• Read and interpret technical drawings and process travelers to determine correct placement of components
• Perform die attach operations, ensuring precise alignment and secure attachment of dies to substrates or packages
• Assemble components according to process specifications and quality standards
• Handle wafers and individual dies with care to prevent contamination or physical damage
• Follow cleanroom protocols and use proper handling techniques
• Set up, operate, and troubleshoot wire bonding equipment
• Perform wire bonding operations to connect dies to package leads or substrates
• Conduct pull tests to verify bond strength and integrity
• Document and report test results
• Inspect assembled products and components at various stages of production
• Use visual inspection, microscopes, and other tools to ensure compliance with Microchip quality standards
• Identify and report defects or process deviations
• Operate production machinery such as plasma cleaners, ovens, and other specialized equipment
• Monitor equipment performance and report issues or malfunctions
• Enter process data, inspection results, and signoffs into computer systems and process travelers
• Maintain accurate and timely records for traceability and quality assurance
• Interface with team members, supervisors, engineers, and other departments to coordinate production activities
• Communicate clearly in English, both verbally and in writing
• Demonstrate commitment to Microchip’s Guiding Values, including teamwork, integrity, and continuous improvement
• Participate in company initiatives and support a positive work environment
• Perform additional tasks as assigned by supervisors or management

Requirements/Qualifications

• High School Diploma or GED
• Minimum 2 years of wire bonding experience with expertise in equipment setup, process optimization, and troubleshooting
• Basic knowledge with Microsoft Windows, Adobe Acrobat Reader, Internet Explorer, and Outlook
• Ability to work independently with minimal supervision
• Good hand-eye coordination and manual dexterity for handling delicate wafers and dies
• Strong verbal and written communication skills in English
• Effective interpersonal skills for building positive relationships across departments

Preferred Qualifications

• Knowledge of Lean manufacturing principles, including 5S workplace organization
• Previous experience in a manufacturing or cleanroom environment

On-the-job training and advancement

On-the-job training provided for specific equipment and processes. Opportunities for advancement to higher technician grades or specialized roles based on performance and experience.