Manufacturing Quality and Reliability Engineer

About the role

TSMC Arizona’s first fab will operate its leading‑edge N4 process, starting production in H1 2025; a second fab will use N3/N2 and be operational in 2028; a third fab will manufacture 2 nm or more advanced chips by the end of the decade. As a Manufacturing Quality and Reliability Engineer you will lead efforts to ensure product quality and reliability for cutting‑edge semiconductor technologies, defining and achieving DPPM targets, assessing reliability risks, solving technical challenges, and collaborating with internal and external stakeholders to meet the highest standards.

Responsibilities

• Define DPPM Targets: Establish and monitor DPPM (defective parts per million) goals for advanced technology processes and drive continuous improvement initiatives to reduce DPPM.
• Perform Reliability Risk Assessments: Conduct product reliability risk assessments for fab events, including CP (control plan), DVS (dynamic voltage scaling), baking, HTOL (high‑temperature operating life), and more.
• Execute Problem‑Solving Processes: Utilize structured methodologies such as PDCA (Plan‑Do‑Check‑Act), 8D, 3Leg/5Why, and KT (Kepner‑Tregoe) to solve technical and analytical challenges.
• Evaluate Engineering Change Impacts: Review engineering changes to ensure adherence to procedures and evaluate their impact on product quality and reliability.
• Customer Communication: Collaborate with customers to discuss product reliability evaluations, test screening methods, and process reliability window assessments.
• Support Continuous Improvement: Actively identify opportunities for innovation, improvement, and accountability in manufacturing processes to achieve reliability goals.

Requirements

Education: Master’s degree in Mechanical, Electrical, Materials Engineering, Physics, Statistics, Reliability, or a related field.

• Technical Skills: At least 3 years of experience in semiconductor quality and reliability, integration, or product engineering.
• Familiarity with reliability testing processes such as TDDB (Time‑Dependent Dielectric Breakdown), HCI (Hot Carrier Injection), BTI (Bias Temperature Instability), EM (Electromigration), and SM (Stress Migration).
• Knowledge of tools such as 4082, MPPT, and Sagi, as well as programming experience in Excel VBA and Python.
• Proven ability to evaluate and implement engineering changes while maintaining reliability standards.

• Interpersonal Skills: Strong communication skills for effective collaboration with internal teams and external customers.
• Proactive and innovative thinker with strong judgment and accountability.
• Self‑motivated and capable of handling pressure in a fast‑paced environment.
• Demonstrated ability to multitask and learn quickly while maintaining operational discipline.

• Physical Requirements: No unique physical requirements beyond standard office and manufacturing tasks. Candidates must be willing and able to work on‑site at the Phoenix, Arizona facility.

Benefits

• Medical, Dental, and Vision Plans: Choose the options that best fit your and your family’s needs.
• Income‑Protection Programs: Financial assistance during injury or illness.
• 401(k) Retirement Savings Plan: Secure your financial future with competitive employer contributions.
• Paid Time‑Off Programs and Holidays: Recharge and spend quality time with loved ones.

Work Location: 5088 W. Innovation Circle, Phoenix, AZ 85083