Manufacturing Process Engineer - SMT

About the role

Develop, validate, sustain, and continuously improve surface mount technology (SMT) processes used to assemble printed circuit boards. Provide hands-on engineering ownership from new product introduction through mature production, with emphasis on safe execution, process capability, first-pass yield, equipment reliability, cost, and on-time delivery. Work across Operations, Quality, R&D, Supply Chain, Maintenance, and external partners to deploy repeatable, data-driven solutions globally. This is a 100% on-site position located in Northford, CT.

Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. person (U.S. Citizen, U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status).

Responsibilities

• Own and improve end-to-end SMT processes including solder paste printing, SPI, component placement, reflow, AOI, AXI, depaneling, rework, and associated material handling.
• Develop and maintain process specifications, equipment recipes, setup sheets, control plans, PFMEAs, work instructions, and training materials.
• Support NPI builds and product transfers; lead DfM/DfA/DfT reviews, tooling readiness, process validation, capability studies, and production release activities.
• Use SPC, DOE, capability analysis, defect Pareto analysis, and structured root-cause methods to improve FPY, OEE, throughput, changeover time, rework, scrap, and labor productivity.
• Troubleshoot process, material, design, programming, feeder, nozzle, printing, placement, soldering, and inspection issues; implement verified corrective and preventive actions.
• Create and optimize placement programs, component libraries, feeder and nozzle strategies, stencil designs, reflow profiles, and AOI/SPI/AXI inspection programs.
• Establish preventive and predictive maintenance requirements with Maintenance; monitor calibration, equipment health, spare parts, obsolescence, and recovery plans.
• Ensure process controls support applicable product, quality, ESD, moisture-sensitive device, safety, environmental, and customer requirements.
• Partner with design engineering and suppliers to resolve PCBA manufacturability and component or material issues before and after release.
• Lead Lean / Six Sigma improvement events and capital projects; define requirements, evaluate suppliers, validate equipment, and manage technical risk, schedule, and benefits.
• Use MES and equipment data to strengthen traceability, process monitoring, standard work, and real-time performance visibility.
• Train and mentor engineers, technicians, and operators; build practical troubleshooting capability and sustain a documented skills matrix.
• Communicate results through concise technical reports, project reviews, risk escalations, and standard engineering change-control processes.
• Provide responsive production support and occasional off-shift support based on manufacturing needs.

Requirements

• 5+ years of relevant manufacturing engineering experience, including direct responsibility for SMT / PCBA processes in a production environment.
• Hands-on knowledge of solder paste printing, pick-and-place, reflow profiling, SPI, AOI, and PCBA defect analysis.
• Working knowledge of statistical process control, process capability, designed experiments, measurement systems, and structured problem solving.
• Experience developing manufacturing documentation and supporting NPI, process validation, equipment qualification, and engineering change control.
• Ability to work effectively with global and cross-functional teams and communicate technical information clearly in English.
• Ability to safely work in a manufacturing environment and travel up to 25%, including international travel when required.

Qualifications

• Bachelor’s degree in electrical, electronics, manufacturing, mechanical or a closely related engineering field.
• Advanced knowledge of IPC-A-610 and IPC J-STD-001; IPC certification is preferred.
• Knowledge of IPC-7711/7721 rework and repair practices, J-STD-020/033 moisture-sensitivity controls, and ANSI/ESD S20.20 or IEC 61340-5-1 ESD controls.
• Experience with Panasonic, ASM, Juki, or comparable placement platforms; Koh Young or comparable SPI/AOI systems; and multi-zone convection reflow ovens.
• Experience with fine-pitch, BGA, QFN, bottom-terminated components, lead-free and tin-lead soldering processes.
• Proficiency with PFMEA, control plans, 8D, DMAIC, DOE, Cp/Cpk, GR&R, and data analysis software.
• Lean or Six Sigma Green Belt / Black Belt certification and demonstrated continuous-improvement results.
• Experience with MES, equipment connectivity, traceability, SAP or another ERP/MRP system, and automated manufacturing data collection.
• Experience specifying, installing, qualifying, or transferring SMT equipment, tooling, fixtures, and automation.
• Project management capability including scope, schedule, risk, capital justification, supplier management, and benefit validation.
• Experience in high-reliability, regulated, industrial, life-safety, or other complex electronics manufacturing environments.
• Analytical, curious, and disciplined in converting production data into practical actions.
• Hands-on and comfortable working at the manufacturing line while maintaining strong documentation and change control.
• Collaborative, inclusive, and able to influence without direct authority across sites and functions.
• Proactive, accountable, and able to balance urgent production support with long-term process improvement.

Pay

The salary range for this position is $82,400 - $103,000. This serves as a general guideline; Honeywell considers various factors when extending an offer, including scope and responsibilities of the position, candidate’s work experience, education and training, key skills, as well as market and business considerations.

Benefits

• Employer-subsidized Medical, Dental, Vision, and Life Insurance.
• Short-Term and Long-Term Disability.
• 401(k) match.
• Flexible Spending Accounts and Health Savings Accounts.
• Employee Assistance Program (EAP) and Educational Assistance.
• Parental Leave.
• Paid Time Off (for vacation, personal business, sick time, and parental leave).
• 12 Paid Holidays.