Manager Systems Design and Architecture

Responsibilities

• Lead system-level architecture evaluation, prototyping, and pathfinding for advanced memory and storage technologies (CXL, DDR/LPDDR, HBM, NVMe, emerging/disaggregated memory), including FPGA-based controller emulation and AI infrastructure prototypes.
• Define requirements, success metrics, and experimental methodologies for performance, cost, power, and scalability tradeoffs.
• Perform architecture impact analysis in response to competitive threats.
• Partner with Software and Applications Modeling teams to connect architectural concepts to real AI workloads and foster cross-team collaboration within SMS and across TPG product groups.
• Own technical execution for multi-year internal and externally funded programs, including milestones, deliverables, and reviews.
• Engage with internal and external partners, vendors, research organizations, and industry standards bodies.
• Support executive-level briefings, roadmap discussions, and team strategy sessions.
• Manage, mentor, and develop a team of senior engineers across hardware, systems architecture, RTL/FPGA, board design, and system validation.
• Strategically grow team capabilities in AI system architecture, memory and I/O protocols, performance/power/TCO modeling, and advanced packaging and interconnect system impact.
• Own resource planning, staffing allocation, budgets, and purchase approvals.
• Ensure lab safety, compliance, and operational continuity.

Requirements

• Bachelor’s degree in electrical engineering, Computer Engineering, Computer Science, or related field (Master’s or PhD preferred) and 10+ years of experience in systems architecture, hardware design, storage, memory, or AI infrastructure.
• Proven experience leading and managing senior technical teams and complex engineering programs, preferably in a pathfinding or advanced R&D organization.
• Deep understanding of memory hierarchies, storage systems, and system-level performance analysis, with technologies such as HBM, DDR/LPDDR, SSDs and NAND.
• Working Knowledge of AI compute and storage system architectures, including xPU (GPU, CPU, DPU, accelerator) memory-storage hierarchy interactions.
• Strong written and verbal communication skills, including executive-level technical presentations.
• Ability to work effectively in an environment with significant ambiguity and rapidly evolving priorities.

Qualifications

• Experience with FPGA-based prototyping, hardware emulation, RTL/Verification flows, board-level development, electrical debug, and lab bring-up.
• Experience with system-level performance modeling (bandwidth, latency, queueing, utilization, trace-based analysis), power/energy/TCO modeling, advanced packaging and interconnect technology evaluation.
• Experience with government-funded research programs or national laboratories, and active participation in industry standards bodies (JEDEC, UCIe, SNIA, NVMe, PCI-SIG, etc.), with a demonstrated ability to bridge research, engineering, and product strategy.
• Experience integrating AI tools into engineering workflows to improve team productivity.

Skills

• Strategic thinking and problem-solving skills.
• Excellent communication and collaboration skills.
• Ability to manage multiple projects and priorities simultaneously.
• Knowledge of industry standards and best practices in memory and storage systems.

Benefits

Micron offers a comprehensive benefits package that includes:

• Medical, dental, and vision plans.
• Choice of retirement savings plans.
• Paid time off and holidays.
• Flexible spending accounts.
• Life insurance and disability coverage.
• Employee assistance programs.
• Discounted products and services.

To learn more about Micron’s benefits, please visit our careers website.