LFAB Cu Plating Process Engineer

About the role

We are seeking an experienced Cu Plating Process Engineer to join our dynamic team. Our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are at the forefront of an exciting era of growth and innovation. You will play a key role in driving our new technology ramp to yield entitlement.

Responsibilities

• Join the team of dynamic engineers that work on process sustenance, development and transfer
• Support manufacturing operations
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements, cost reduction or quality improvement programs, new product support and other process improvements
• Perform lot and equipment dispositions to support the continuous flow of production and to minimize cycle time in a high volume manufacturing 300mm wafer Fab running Analog Technologies
• Identify systematic problems in either process or equipment related sources and communicate findings to the engineering staff in a continuous manner
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Participate in data analysis and problem resolution
• Support 28nm CMOS Planar technology

Qualifications

• Minimum requirements: 3 years of experience within the Semiconductor industry. Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related engineering field
• Strong foundation in statistical process control, engineering change control and process release strategies
• Preferred qualifications: 3 years of experience with Plating in a semiconductor environment. Experience with Cu Plating and Cu Barrier Seed. BEOL process integration experience. Demonstrated strong analytical and problem solving skills. Ability to adapt and be dynamic. Ability to work effectively in a fast-paced and rapidly changing environment. Ability to take the initiative and drive for results. Demonstrated ability to build strong, influential relationships. Strong verbal and written communication skills. Ability to work in teams and collaborate effectively with people in different functions. Strong time management skills that enable on-time project delivery

About LFAB

LFAB (Lehi Fab) is committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K-12 STEM education. We are at the forefront of an exciting era of growth and innovation, driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes.