Lead Thermal Mechanical Engineer

About the role

We are a fast-moving startup building the foundation for next-generation AI compute. We are seeking a hands-on technical leader to develop the next-generation thermal management solutions for advanced power delivery chiplet technologies targeting AI/data center platforms.

This role is at the intersection of semiconductor packaging, thermal architecture, mechanical integration, and high-volume manufacturing. You will work closely with internal silicon, package, reliability, and operations teams, while interfacing directly with Tier-1 customers, OSATs, substrate vendors, material suppliers, and ecosystem partners.

Responsibilities

• Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
• Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
• Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
• Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
• Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
• Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.

Requirements

• MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field.
• 10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems.
• Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent.
• Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications.
• Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling.
• Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows.

Qualifications

Compensation & Benefits
Anticipated annual base salary: $175,000 - $225,000
Stock option grant
Comprehensive benefits package including health, dental, vision, and 401(k)