Layout Design Intern

About the role

Join a team that creates semiconductors powering cutting-edge technologies like smartphones, cars, satellites, robotics, and more. As a Layout Design Intern, you will develop and prepare multi-dimensional layouts and detailed drawings of semiconductor devices from schematics and related geometry provided by design engineering.

You will create and manage integrated circuit (IC) layouts from start to finish using CAD software, floor-planning, designing, implementing, and verifying analog integrated circuits. You will collaborate with design engineers to meet precision, speed, area, reliability, power, and ESD requirements, and work with PE/Packaging engineers to ensure reliable production capability and proper data preparation for fab hand-off, documentation, and archive.

Responsibilities

• Collaborate with Analog and Digital design teams and the global layout design community.
• Understand manufacturing rules and implement layout to be robust and area-efficient.
• Write layout specifications, check dimensions, and verify completed artwork.
• Verify that the layout is compliant with Design Rule Checks (DRCs) and Electrical Rule Checks (ERCs).
• Participate in layout design reviews.
• Create design flow automation.

Requirements

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

Qualifications

• Currently pursuing an Associate’s or Bachelor’s degree in Electrical Engineering, Engineering Technology, or a related field.
• Minimum 3.0 out of 4.0 GPA.

Skills

Preferred qualifications:

• Working knowledge of electrical circuits such as resistance, capacitance, voltage, and current.
• Familiarity with Unix/Linux, Cadence Virtuoso, Assura LVS, DRC, or similar mixed-signal EDA tools (Mentor, Synopsys).
• Basic proficiency in one or more coding languages such as Perl, Python, C, or Cadence SKILL.
• Familiarity with semiconductor device physics, analog circuits, and their layout sensitivities.
• Working knowledge of semiconductor processes and IC production flow, including BJTs, Diodes, FETs, passive components, packaging, and thermal design.
• Working knowledge of layout-related matching techniques, on-chip parasitic sources and minimization, routing impedances and electromigration, and crosstalk.
• Ability to establish strong relationships with key stakeholders, both internally and externally.
• Strong verbal and written communication skills.
• Ability to quickly ramp on new systems and processes.
• Demonstrated strong interpersonal, analytical, and problem-solving skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ability to take initiative and drive for results.
• Strong time management skills that enable on-time project delivery.