Laser Dicing Operator

About the role

Fresh Consulting is a design‑led software development and hardware engineering company that delivers end‑to‑end digital services. The Laser Dicing Operator will run laser dicing and cutting of optical substrates, wafers, and prototype assemblies to tight tolerances, working directly with engineers and scientists on research prototypes for next‑generation AR/VR optics and displays. The facility includes CO₂, UV, fiber, and ultrafast laser systems plus precision dicing saws.

Responsibilities

• Set up, operate, and maintain laser dicing and cutting systems for prototype fabrication.
• Run process recipes to specification and help tune parameters across materials (glass, silicon, SiC, polymers, optical films).
• Handle and align wafers and substrates — mounting, taping, cleaning, de‑taping.
• Inspect and verify parts using optical microscopes and standard measurement tools; log yield and defects.
• Perform routine maintenance and calibration; escalate tool issues and coordinate vendor service.
• Keep equipment logs, process records, and consumables inventory current.
• Follow all laser safety, EHS, and facility protocols, and keep the work cell clean and organized.

Benefits

• Medical coverage at 100%.
• Paid time off (PTO) and holiday pay.
• 401(k) plan.
• Additional employee benefits.

Pay

Compensation is based on location, level, job‑related knowledge, skills, and experience. The hourly range is $60 – $70.

Schedule

Minimum 40 hours per week.

Equal Opportunity

All qualified persons will be considered for employment without regard to race, color, religion, sex, national origin, age, marital status, familial status, gender identity, sexual orientation, disability (reasonable accommodation will be provided when needed), or any other status protected by law. Fresh Consulting participates in E‑Verify.