Integration Engineer

About the role

The Process Integration Team is seeking an Integration Engineer to join a collaborative and highly technical group of 10-12 engineers with diverse backgrounds and expertise. This team partners closely with process module engineering organizations to identify, troubleshoot, and resolve manufacturing and quality challenges across the semiconductor fabrication process. Team members gain broad exposure to silicon-based semiconductor products, supporting all stages of production from starting silicon through wafer fabrication, assembly, and final packaged die.

Responsibilities

• Interpreting and responding to electrical signals from Si-based semiconductor devices and establishing connections to process conditions
• Leading teams of process module engineers to resolve yield and parametric problems
• Optimization of semiconductor manufacturing processes to improve productivity and/or quality
• Interpretation of SEM, TEM, and EDX analysis to establish root cause of electrical signals in semiconductor devices
• Transfer of Si semiconductor processes between manufacturing facilities and to larger wafer diameter in the same facility
• Teamwork with Product and Defect engineering to identify yield limiters for yield improvement

Requirements

• BS or MS in Electrical Engineering or associated engineering field with semiconductor device background
• 0-3 years of experience working in a cleanroom environment
• Understanding of CMOS and Bipolar Junction Transistor structures and device operation
• Ability to work in a team environment with strong written and verbal communication skills
• Basic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA)

Preferred Qualifications

• Knowledge of Statistical Process Control (SPC)

Minimum Qualifications

• BS or MS in Electrical Engineering or associated engineering field with semiconductor device background
• 0-3 years of experience working in a cleanroom environment
• Understanding of CMOS and Bipolar Junction Transistor structures and device operation
• Ability to work in a team environment with strong written and verbal communication skills
• Basic understanding of operation of common semiconductor process operations: Photolithography, Plasma etch, Plasma Enhanced Chemical Vapor Deposition (PECVD), Epitaxial growth, Furnace oxidation and Low Pressure Chemical Vapor Deposition (LPCVD), Implant, Chemical Mechanical Polish (CMP), Wet chemical etch, Physical Vapor Deposition (PVD), Rapid Thermal Anneal (RTA)