Integration Engineer (52117)

Under the direction of the Sr. Manager of Plating Manufacturing Engineering, the Integration Engineer is responsible for monitoring, sustaining, and providing support for the manufacturing process, including detecting and correcting process errors, releasing and integrating new programs into the manufacturing line, providing guidance and support to engineers regarding experiments or evaluations, and providing feedback to the back-end process group. This position is located in Milpitas, California.

Responsibilities

• Engages in process improvement activities based on Wafer Design Change Notifications (WDCN) and Wafer Process Change Notifications (WPCN), including following up with CCN documentation for line conversion activity
• Examines newly transferred products to ensure leading wafer follows wafer configuration specifications
• Evaluates sample wafers, conducts experiments, and reviews results in support of yield improvement activities; issues Lot Configuration Changes (LCC) and CCN’s as needed
• Interprets analytical defect data from imaging equipment such as FIB, SEM, EDX, and TEM
• Monitors and supports manufacturing process controls to alert for abnormal wafers; recommends corrective action if needed
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) and other complex software applications to analyze large volumes of data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level

Requirements

• Bachelor’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience
• Three years of hands-on experience working in either the magnetic thin film fabrication or semiconductor industries in a manufacturing or process engineering role
• Strong analytical and critical thinking skills
• Hands-on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

Skills

• Knowledge of magnetic recording head or HDD manufacturing
• Knowledge and ability to understand various defect image results from FIB, SEM, EDX, and TEM tools
• Knowledge and technical understanding of circuit design and testing
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Ability to design complex experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Demonstrated analytical, organizational, and time management skills
• Demonstrated problem-solving and troubleshooting skills
• Flexible and able to prioritize

Working Conditions

• Works primarily in an office environment from Monday through Friday; schedule may be altered to meet business or operational needs
• Works in a class 100 ESD-sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask
• May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of the workday; may be exposed to loud noise
• Stands, walks, bends, and twists; performs various fine grasping movements
• Operates a computer, telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds

Pay

The annual base salary for this full-time position is between $120,819.00 and $177,675.00, plus bonus target and benefits. Within the range, individual pay may differ depending on job responsibilities, job-related knowledge, skills, abilities, education, and experience.