IC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027)

Skyworks is an innovator of high-performance analog semiconductors whose solutions power the wireless networking revolution. Through broad technology expertise and an extensive product portfolio, we are Connecting Everyone and Everything, All the Time. Join a fast-paced, collaborative environment with minimal layers of management and the freedom to make meaningful contributions while encouraging creative thinking.

About the role

The Skyworks Packaging team is seeking an IC Packaging Thermal/Mechanical Simulation co-op student. This internship will focus on integrated circuit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA). The internship will run from January to June 2027.

Responsibilities

• Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.
• Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.
• Support analysis of package warpage, stress, deformation, and temperature distribution.
• Help prepare engineering reports, presentations, and summaries of simulation findings.
• Develop basic automation scripts or data analysis tools using ANSYS APDL scripting, Python, or similar software.
• Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Requirements

• Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.
• Basic understanding of mechanics, heat transfer, and engineering fundamentals.
• Exposure to CAD, FEA, Python, or other engineering software is a plus.
• Strong analytical, problem-solving, and communication skills.
• Eagerness to learn semiconductor packaging technologies and simulation methodologies.

Pay

The typical pay range for an Engineering intern across the U.S. is USD $26.00 - $47.50 per hour. Starting pay depends on level of education, job duties, requirements, and work location.