Head of Sensing

About the role

The Head of Sensing will own the sensing stack end-to-end, from modality to system architecture, signal acquisition and conditioning, and the interface into the ML pipeline. They will lead the sensing organization, set the multi-generation sensing roadmap, and partner closely with ML, hardware, firmware, and product teams to ship a sensing system that is performant, manufacturable, and power-efficient in a consumer wearable form factor.

Responsibilities

• Own the sensing system architecture end-to-end.
• Set the multi-generation sensing roadmap — define what each hardware generation must prove, and how the sensing subsystem evolves from current prototype units through closed beta to consumer launch.
• Own the sensing KPIs — SNR, power, thermal, repeatability across units and users — and drive the architecture choices needed to hit them.
• Partner with the ML team on the signal-to-model interface: what the model needs from the system, where to spend bits and power, and how to co-design hardware and model for product-level performance in a wearable form factor.
• Lead and grow the sensing team, composed of both electrical engineers, sensors specialists, and data scientists.
• Drive R&D on novel sensor designs and modalities — explore, prototype, and de-risk new sensing approaches that could define future hardware generations.
• Advance multimodal signal integration, fusing complementary sensing channels into a coherent system that maximizes information delivered to the model.
• Develop new SNR and signal-quality measures to rigorously quantify system performance and guide architecture decisions.
• Partner with the Head of Hardware on integration, EVT/DVT/PVT, DFM/DFT for the sensing subsystem, and with CMs/ODMs on manufacturability.
• Own regulatory readiness for the sensing subsystem in partnership with hardware.
• Communicate sensing tradeoffs clearly to the rest of the company — what we are giving up, what we are gaining, and why.

Requirements

• 10+ years of experience designing sensing systems.
• Wearables, EMG, accelerometers, UWB, mmWave, bioimpedance, ultrasound, or comparable domains are all relevant.
• Track record of taking a sensing architecture from research prototype through mass production.
• Experience leading and growing technical teams (3–10 engineers), including hiring senior ICs and managers and managing through other managers as the team scales.
• Strong systems intuition.
• Comfortable trading off across sensing, mechanical, thermal, power, and ML constraints, and explaining the tradeoffs to non-technical stakeholders.
• Demonstrated ability to co-design hardware with an ML or perception pipeline — you have shipped a product where the model and the sensor were designed together, not over the wall.
• High ownership in a small-team environment. You can set direction without a large org behind you and operate effectively when the spec is still moving.
• You are not afraid to do IC work, instead, you deeply enjoy getting into the weeds.
• Strong candidates may have Experience with non-invasive biosignal sensing (EMG, bioimpedance, or comparable modalities).
• Experience with head-worn or ear-worn form factors and the ergonomic and thermal constraints they impose.
• PhD in EE, applied physics, or a related field.

Compensation Range

$190,000 - $230,000/yr

Benefits

• Competitive equity package
• Comprehensive medical, dental, and vision insurance
• Company size: 20-30 people
• Unlimited PTO
• Visa sponsorship
• 4% 401k matching