FIB Technician

Responsibilities

• Perform FIB cross-sections and SEM imaging to evaluate process integrity, defect mechanisms, and structural characteristics on semiconductor devices.
• Support additional sample-preparation approaches, including S-TEM lift-out, as needed and as experience develops.
• Support the Production Fab through rapid physical analysis for tool and process qualification, lines down events, uncontained excursions, scrap disposition, and other high-priority production issues.
• Manage work from the online request system by interpreting analysis needs, selecting appropriate approaches, identifying when additional techniques may be helpful, and clarifying ambiguous or incomplete requests directly with requestors.
• Prioritize incoming requests based on fab urgency, business impact, and operational need while working within a compressed schedule that may include Saturday or Sunday coverage and 3-day 12-hour or 4-day 12-hour shifts based on business needs.
• Partner with fab, process, product, and failure analysis teams to identify root cause, contain issues, and communicate clear analytical findings, risks, and recommendations to engineering stakeholders.
• Maintain equipment, workflow readiness, and compliance with lab safety, cleanroom protocols, and operating standards while driving improvements in throughput, repeatability, and data quality.

Requirements

• Minimum associate’s degree, technical certification, or equivalent hands-on experience in Materials Science, Electrical Engineering Technology, Physics, Chemical Engineering Technology, or a related technical field; relevant semiconductor lab or failure analysis experience may be considered in lieu of formal education.
• Hands-on experience with FIB cross-sectioning and SEM imaging in a semiconductor production, process characterization, or failure analysis environment.
• Ability to manage ambiguous or incomplete requests by asking clarifying questions, interacting effectively with requestors, and prioritizing work based on urgency, technical need, and fab impact.
• Strong written and verbal communication skills, with the ability to work effectively in a fast-paced fab support environment and clearly communicate technical findings to cross-functional engineering teams.

Qualifications

• Minimum associate’s degree, technical certification, or equivalent hands-on experience in Materials Science, Electrical Engineering Technology, Physics, Chemical Engineering Technology, or a related technical field; relevant semiconductor lab or failure analysis experience may be considered in lieu of formal education.
• Hands-on experience with FIB cross-sectioning and SEM imaging in a semiconductor production, process characterization, or failure analysis environment.
• Ability to manage ambiguous or incomplete requests by asking clarifying questions, interacting effectively with requestors, and prioritizing work based on urgency, technical need, and fab impact.
• Strong written and verbal communication skills, with the ability to work effectively in a fast-paced fab support environment and clearly communicate technical findings to cross-functional engineering teams.

Skills

• Hands-on experience with FIB cross-sectioning and SEM imaging in a semiconductor production, process characterization, or failure analysis environment.
• Ability to manage ambiguous or incomplete requests by asking clarifying questions, interacting effectively with requestors, and prioritizing work based on urgency, technical need, and fab impact.
• Strong written and verbal communication skills, with the ability to work effectively in a fast-paced fab support environment and clearly communicate technical findings to cross-functional engineering teams.

Benefits

• Medical, vision, and dental coverage.
• 401(k) plan.
• Paid vacation, holidays, and sick time.

Pay

$38 to $53 per hour

Schedule

1st Shift/Days