Failure Analysis and Reliability Engineer

About the role

We are looking for a Quality Engineer II to support component- and board-level failure analysis for advanced semiconductor products. In this role, you will perform electrical verification, fault isolation, physical failure analysis, board-level analysis, reliability stress support, and clear technical reporting. This is a hands-on engineering position suited for someone who enjoys solving complex technical problems, working across teams, and driving issues from initial investigation through root-cause conclusion. Job level will be aligned to the selected candidate's experience.

Key Responsibilities

• Perform component- and board-level failure analysis to determine root cause of product or board failures.
• Conduct electrical verification, fault isolation, and physical failure analysis using appropriate tools and techniques.
• Perform board-level dye-and-pry analysis, PCB construction analysis, and physical failure analysis of PCB assemblies.
• Support board-level reliability stress testing and bench testing before and after stress exposure when needed.
• Document analysis results in clear, accurate failure analysis reports with evidence-based conclusions and recommended next steps.
• Work with cross-functional engineering teams to investigate issues, communicate findings, and support corrective actions.

Required Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or a related technical field.
• 1–3 years of experience in semiconductor failure analysis, product quality, reliability engineering, board-level analysis, or a related technical area.
• Hands-on experience with electrical fault isolation and physical failure analysis methods.
• Ability to analyze technical data, draw logical conclusions, and communicate results clearly in written reports.
• Strong problem-solving skills, attention to detail, and ability to manage investigations with limited supervision.

Preferred Qualifications

• Experience with dye-and-pry testing in accordance with IPC-TM-650 methods.
• Experience with precision cross-sectioning, parallel lapping, chemical deprocessing, or related physical analysis techniques.
• Familiarity with failure analysis tools and techniques such as curve tracing, C-SAM, X-ray, TDR, OBIRCH, thermal emission microscopy, and SEM.
• Knowledge of semiconductor reliability stress testing, CMOS devices, circuit analysis, diagnostic techniques, IC fabrication, and assembly processes.
• Ability to collaborate effectively with cross-functional engineering, quality, reliability, and product teams.