Executive Director of R&D Engineering for 3DIC-Advance Packaging

Job Description

We Are
Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

Requirements

• Bachelor's or Master's degree in Electrical Engineering or a related technical discipline, or equivalent professional experience with demonstrated technical leadership in semiconductor design
• 15+ years of hands-on experience in the semiconductor industry with deep expertise in advanced packaging, 3DIC technologies, chiplet architectures, and heterogeneous integration
• Proven track record building and leading large, geographically distributed engineering organizations that have delivered complex 3DIC or advanced packaging solutions from architecture through production
• Deep technical command of 3DIC-specific design and signoff challenges including signal integrity, power integrity, thermal management, mechanical stress, reliability physics, and yield optimization
• Demonstrated ability to define and execute multi-year technology roadmaps for silicon IP or advanced packaging, balancing technical vision with business strategy and market requirements
• Strong customer-facing leadership experience, including direct engagement with semiconductor customers, foundries, and ecosystem partners to define requirements, validate solutions, and drive adoption
• Experience working effectively in highly matrixed, global organizations, influencing across EDA development, product management, go-to-market, manufacturing, and customer success teams without direct reporting authority

Qualifications

• You have spent the better part of two decades building semiconductor solutions that actually ship, not just pass design reviews, and you know that the hardest problems in 3DIC are never just technical. They live at the intersection of physics, economics, and customer reality.
• You lead organizations that span continents and disciplines, and you have learned that the difference between a team that delivers and one that stalls is usually clarity. Clarity of purpose, clarity of decision rights, clarity of what good looks like. You do not manage by deck, you manage by walking into a room, understanding the blocker, and removing it.
• You have credibility with customers because you have been in the room when a design did not work and you helped fix it. You have credibility with engineers because you still understand the signoff flow. You think in roadmaps, not features, and you know how to translate a market shift into a three-year technical plan that your team can actually execute.
• You can walk into a technical review with your team, identify the core issue in a complex 3DIC signoff problem, and outline a path forward that balances technical correctness with schedule reality.
• You build teams that want to work for you again, not because you are easy to work for, but because you are clear, you remove obstacles, and you give people hard problems they can actually solve.
• You can sit across the table from a VP of Engineering at a top five semiconductor company, understand their chiplet integration challenges, and translate that into a technical requirement your team can execute against.
• You make tradeoff decisions with incomplete information, and you are comfortable explaining the reasoning behind those decisions to both your team and executive leadership.
• You recognize when a technical plan is drifting from a business objective and you course-correct before it becomes a crisis, not after.
• You invest in the growth of your engineers, you know who is ready for the next level, and you create opportunities for them to get there.

Skills

• Leadership in semiconductor design
• Advanced packaging and 3DIC technologies
• Chiplet architectures and heterogeneous integration
• Signal integrity, power integrity, thermal management, mechanical stress, reliability physics, and yield optimization
• Customer engagement and validation
• Technical roadmap definition and execution
• Tradeoff decision-making
• Team building and mentoring

Benefits

• Comprehensive medical and healthcare plans
• ETO and FTO Programs
• Maternity and paternity leave, parenting resources, adoption and surrogacy assistance
• Retirement plans varying by region and country
• Competitive salaries