Engineer II

About the role

UCT is a fast-growing sector in the world, indirectly touching every semiconductor chip used in smartphones, smart cars, and devices with AI. This role is crucial for the semiconductor industry and UCT, evolving alongside technological advancements.

Responsibilities

• Apply knowledge of manufacturing practices, assembly prints, and bills of materials to create manufacturing-ready documentation, including S.O.E. and Assembly Process Workflow.
• Provide technical direction and on-the-job training to production staff.
• Plan, schedule, conduct, and coordinate the Manufacturing Engineering portion of the system build.
• Prepare and/or modify work instructions, BOM structures, and training curriculum within SAP and supporting systems.
• Ensure proper interdisciplinary coordination and effective communication across projects.
• Interface with customers and vendor representatives; attend and participate in customer meetings.
• Confer with engineers, technicians, customers, and others to identify best practices and streamline build processes and procedures.
• Inspect completed systems; partner with Manufacturing and Quality organizations to ensure conformance to design and equipment specifications and compliance with operational and safety standards.
• Support project production efforts to ensure projects are completed on time and within budget.
• Investigate customer or internal issues, determine nature and extent of the problem, and recommend corrective actions.
• Aid in cost estimation and the development of capital project programs for new equipment and major repairs.
• Evaluate and process Engineering Change Orders (ECOs).
• Perform other duties as required.

Requirements

• Self-starter with high motivation and a hands-on approach to problem-solving on the production floor.
• Familiarity with semiconductor capital equipment manufacturing strongly preferred.
• SAP ERP experience is a major plus — the successful candidate will work in SAP extensively (routings, BOMs, work orders, ECOs, and reporting).
• SolidWorks experience is a real plus, with 4–6 years of hands-on use preferred (part and assembly modeling, drawings, sheet metal, and DXF export).
• Leverage Lean Manufacturing principles; Six Sigma Green Belt preferred.
• Knowledge of electronic Work Instruction software (e.g., Sequence) is a plus.
• Excellent computer skills in the Microsoft Office Suite, with emphasis on Excel.
• Prior experience leading small teams to achieve project success.
• Strong interpersonal skills; ability to work independently or in a team environment.

Qualifications

• Bachelor of Science or Bachelor of Arts degree in Engineering, Physical Sciences, Manufacturing, or a related field is required, preferably with coursework or exposure to the semiconductor industry.
• Candidates without a degree must have a minimum of 5–10 years of directly related manufacturing engineering experience, ideally in semiconductor capital equipment or a comparable high-technology environment.
• Experience Requirements: 5+ years of related experience in high-technology manufacturing, preferably in semiconductor capital equipment or a related industry.
• Work knowledge of a quick-turn, engineer-to-order environment.
• Demonstrated experience working within an ERP system; SAP strongly preferred.
• 4–6 years of SolidWorks experience strongly preferred.