Electronic Assembler/BGA Repair Technician - Temp

About the role

Sanmina Corporation (Nasdaq: SANM) is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. The Senior Electronic Assembler/BGA Repair Technician will assemble Circuit Card Assemblies using Bill of Material, Drawing and Work Instructions.

Responsibilities

• Assemble Circuit Card Assemblies using Bill of Material, Drawing and Work Instructions.
• Repair complex defects and apply intricate ECO rework.
• Perform Ball Grid Array (BGA) removal and replacement, including BGA removal, site prep, solder application, BGA place and reflow.
• Determine correct BGA nozzle, stencil, and rework profile.
• Identify temperature sensitive components or parts (e.g., fiber optics, plastic connectors, batteries).
• Conduct solder paste printing, reflow soldering, and component placement machine operations.
• Utilize X-ray images and visual inspections to validate work for acceptance.
• Read and understand English documents, drawings, BOMs, work and ECO instructions.
• Follow procedures (SOPs) and documentation.
• Assemble products or sub-assemblies according to verbal or written instructions, drawings, or diagrams.
• Repair damaged circuits, lands, surface mount pads, including defects in the base board and mask surface.
• Perform micro scope soldering and component rework.
• Stand for long periods of time (SMT line operator).
• Walk 200 feet several times a day to wash circuit cards.
• Lift 25 lbs or more several times a day.
• Work overtime as needed.

Requirements

• Knowledge of IPC 610 and J-Standards and current certification or certification within the past three years.
• In-depth understanding of Surface-Mount Technology (SMT), including electronic component package types and SMT assembly process.
• Ability to hand solder components sizes down to 0201 packages.
• Ability to use tools and systems including BGA rework station, solder station, electric screwdrivers, torque screwdrivers, wire strippers, pliers, etc.
• Willingness and experience working in a fast-paced environment with adaptability to changing priorities.
• High degree of quality workmanship (IPC 610 class 3 and above).

Qualifications

• High school diploma or equivalent.
• 2–4 years of experience in electronics assembly and repair.
• 3 years of BGA removal and replacement experience.
• 2–4 years of experience operating surface mount machines (desired).

This is an ITAR facility and applicants must be a US Citizen or a lawful permanent resident.