DRAM Device & Process Integration Engineer

Role: Process Integration Engineer in the DRAM R&D Memory Group, focusing on developing core memory technology for AI-enabled applications. Responsibilities Own process integration for front-end DRAM modules, defining schemes, managing unit processes, and meeting technology milestones.Design and execute experiments (DOEs), analyze data, and troubleshoot root causes.Utilize device and process modeling tools (e.g., TCAD, Sentaurus) to evaluate process interactions, device behavior, and scaling options, correlating simulations with experimental data to improve models.Collaborate cross-functionally with process development, device engineering, yield, analysis, manufacturing, and quality teams to resolve issues.Summarize complex problems, develop actionable recommendations, and facilitate team consensus.Support transfer of technology from R&D to manufacturing, achieving project milestones. Qualifications MS or PhD in Electrical Engineering, Physics, Materials Science, or related field with industry experience.Experience in semiconductor process integration, development, and problem-solving.Knowledge of semiconductor device physics and hands-on experience with modeling tools.Strong data analysis, DOE, and statistical skills. Preferred Skills Advanced experience in memory, logic, or advanced-node integration.Experience in transferring technology from R&D to manufacturing.Excellent communication, organizational, and team collaboration skills.Self-motivated with a passion for solving technical challenges.