Director of Packaging Engineering and Site Manager

Elevate Quantum is a 501c3 non-profit dedicated to accelerating innovation in quantum technology from the Mountain West’s largest cluster. Our consortium includes over 120 organizations across Colorado, New Mexico, and Wyoming, spanning industry leaders, research institutions, and workforce builders. Recognized as a Designated TechHub by the U.S. Department of Commerce, we are driving advancements in quantum technology with significant federal and state investments.

About the Role

Elevate Quantum is launching a first-of-its-kind quantum packaging and heterogeneous integration facility in Albuquerque, NM, in partnership with Sandia National Laboratories and the University of New Mexico. This facility will support next-generation chip and photonics-based packaging techniques for quantum systems. We are seeking a Director of Packaging Engineering and Site Manager to lead the establishment and operations of this facility. This role is both strategic and operational, offering the opportunity to shape critical quantum infrastructure in an emerging field with global implications.

Responsibilities

• Strategy & Leadership
  • Build and lead a new business unit focused on quantum-relevant chip-based packaging processes (e.g., ion traps, neutral atom).
  • Collaborate with Elevate Quantum’s officer team to define technical roadmaps and commercialization strategies.
  • Serve as a technical expert in business development and industry conferences.
• Facility Management
  • Oversee on-the-ground operations, including facility build-out, equipment installation, and lab commissioning.
  • Develop and implement standard operating procedures (SOPs), lab safety protocols, and process documentation.
  • Track progress and report milestones to the COO/CFO.
• Engineering & Technical Execution
  • Lead the development and optimization of quantum packaging processes, including active fiber alignment, wire bonding, flip-chip bonding, solder jetting, and metrology.
  • Manage cleanroom operations and production of novel chip-based quantum and opto-electronic packages.
  • Drive continuous process improvement and implement rigorous quality assurance practices.
• Team & Partner Management
  • Recruit, train, and supervise a growing technical team.
  • Collaborate with Sandia National Labs to access process IP, develop training programs, and coordinate joint R&D efforts.
  • Engage with university and commercial partners to expand capabilities and customer base.

Requirements

• 5+ years of experience in semiconductor packaging, photonics integration, or heterogeneous device manufacturing.
• Master’s degree in a relevant field (PhD preferred but not required).
• Demonstrated success in building and leading advanced R&D or pilot manufacturing facilities.
• Ability to adapt to evolving customer needs in the rapidly changing quantum ecosystem.
• Strong process development skills and familiarity with cleanroom operations.
• Exceptional communication, organizational, and leadership skills.

Preferred Qualifications

• Direct experience with chip-based packaging processes (e.g., wire bonding, active fiber coupling, flip-chip bonding).
• Experience packaging quantum-relevant devices (e.g., ion traps, neutral atom).
• Knowledge of low-volume production environments and metrology.
• Ability to present technically at conferences to support thought leadership and business goals.
• Prior collaboration with national laboratories or experience in federally funded research.

Benefits

• Lead a first-of-its-kind facility in a globally strategic industry.
• Shape the future of U.S. leadership in quantum packaging.
• Collaborate with top-tier scientists, engineers, and national lab partners.
• Support breakthroughs in quantum computing, sensing, and communications.

Pay

$180,000 – $210,000, commensurate with experience.