Director of Engineering

Summary

The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engagement with customer engineers and technologists across their global organizations from IC design, package and system architects, manufacturing and market applications, as well as through conferences and industry forums. This position serves as the critical bridge between market demand and technology innovation, translating customer product roadmaps and industry trends into packaging technology strategies and business opportunities through deep technical dialogue, early-stage architecture influence, and ecosystem collaboration.

Responsibilities

• Promote strategic technology platforms to global customers
• Provide technical leadership in engagements with customer engineering organizations, including design, technology and product development
• Work closely with factory engineering, R&D, and Sales to align customer technology requirements with development roadmaps, and business growth objectives
• Represent the company at industry events, conferences, and technical forums to promote capabilities, technology leadership, and competitive advantages
• Develop technology and service promotion strategies with key customers by understanding their business drivers, IC applications, system architectures, and market positions
• Create technical marketing materials (presentations, white papers, and technical briefings) to effectively communicate the company's capabilities and technology differentiation
• Deliver technical presentations and engage with customer design, packaging and system teams to promote and position our technologies for next-generation products
• Collaborate with application engineering and Sales to promote technical capabilities, roadmaps, and manufacturing strengths
• Facilitate communication between customers and internal engineering teams to address technology gaps and support product deployment. Contribute long-term roadmap development with manufacturing and R&D organizations
• Advise internal stakeholders on customer technology trends, competitive positioning, and key technical issues
• Drive technology engagements that lead to new business opportunities and design wins, increasing adoption of the company's strategic platforms
• Support executive management in shaping long-term advanced packaging technology and business strategies

Education and/or Experience

We prefer candidates with a Bachelor's, Master's, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or a related field, with 12+ years of semiconductor industry experience, preferably in semiconductor packaging or advanced packaging technologies. Candidates should have experience managing strategic customer accounts and strong verbal, written, and interpersonal communication skills. The role requires the ability to deliver technical presentations, develop customer proposals, and provide structured progress reports. Strong organizational and computer skills are required. Additional qualifications include proven ability to analyze technology and market trends to define and execute short-term and long-term business strategies, strong understanding of semiconductor device physics, packaging technologies, and manufacturing processes, including flip chip, bumping, 2.5D/3D, high-density fan-out, and silicon photonics integration, familiarity with emerging trends such as chiplet integration, advanced interconnects, substrate innovations, and electrical and thermo-mechanical performance optimization, and advanced manufacturing processes, knowledge of packaging reliability, defect analysis, and qualification processes, experience in package development, architecture planning, and SI/PI performance analysis at package and PCB system levels, experience with DOE methodologies, BOM development, and thermo-mechanical assessments, working knowledge of engineering simulation tools (e.g., FEA, HFSS, CFD, Cadence APD), is a plus, proven strong ability to work independently and collaborate effectively with customers, vendors, and internal teams to develop and support advanced packaging technologies, active participation in industry networks or professional societies is highly desirable.