Director, New Product Development

Responsibilities

• Evaluate the Datacenter/AI rack market and customers, recognize trends and set forth a plan to penetrate business opportunities/applications that will deploy a liquid cooled interconnect solution for switch and compute applications.
• Define the customer engagement strategy specific to the Thermal engineering teams and work with the organization to drive revenue and profit growth through customer design wins.
• Coordinate product support functions targeting customer engagement and qualification requirements (Application engineering, Qual testing, etc.).
• Business planning and execution driving the product development roadmap as well as operational readiness (supply planning, production capacity, supplier selection and related activities).

Requirements

• Bachelor degree in Engineering or related technical discipline (Optics, Electrical and or mechanical engineering)
• At least 7 years of thermal component development (High speed communication systems) and program/project management
• Experience in cold plate implementations at the Chassis and Rack level for Design and test
• Experience developing customer relationships at the leadership level
• Experience communicating across all levels of business and executive leadership presence
• Business acumen to deliver high level communication in the specified field

Qualifications

• Bachelor degree in Engineering or related technical discipline (Optics, Electrical and or mechanical engineering)
• At least 7 years of thermal component development (High speed communication systems) and program/project management
• Experience in cold plate implementations at the Chassis and Rack level for Design and test
• Experience developing customer relationships at the leadership level
• Experience communicating across all levels of business and executive leadership presence
• Business acumen to deliver high level communication in the specified field

Skills

• Technical specification development for the liquid cooled cage product including total power, temperature rise, liquid flow rates, mechanical geometry specific to front panel chassis requirements supporting both networking and compute hardware specific to host (switch) to module (NIC card) cabling applications.
• Identify product and application trends/opportunities to drive next gen product roadmaps aligning with Switch and GPU silicon suppliers in addition to the enterprise networking chassis suppliers.
• Support application engineering during system bring up/debug (Thermal qualification).
• On-site test setup, troubleshooting and design engineering feedback to address application specific changes.
• Establish partnerships with the liquid cooling eco system (Cold plate, QD) suppliers.
• Act as a technical lead to establish acceptable performance criteria, tolerance ranges, long term reliability and durability as well as developing an advanced development roadmap to address potential future needs of next generation systems.
• Set direction to ensure operational readiness to support customer qualification and production timing requirements.

Benefits

Our goal is for each employee, and their families, to live fulfilling and healthy lives. We provide essential resources and support to build and maintain physical, financial, and emotional strength - focusing on overall wellbeing so you can focus on what matters most. Our benefits plan includes - medical, dental, vision, flexible spending and health savings accounts, life insurance, ADD, disability, retirement, paid vacation/time off, educational assistance, and may also include infertility assistance, paid parental leave and adoption assistance.

Pay

$200,000 - $250,000 per year

Schedule

N/A