Director, Manufacturing and Test Engineering

About the role

Celestica is looking for a dynamic, high-velocity Director of Manufacturing and Test Engineering to lead our Advanced Engineering and Process Development teams. This is a critical leadership role responsible for bridging the gap between cutting-edge product technology roadmaps and full-scale manufacturing execution.

The ideal candidate brings deep technical knowledge in semiconductors, advanced packaging, and PCBs, combined with an assertive, execution-oriented leadership style capable of matching the rapid life cycles of the AI-driven tech market.

Responsibilities

• Advanced Process & Equipment Development: Identify, scope, and manage customer-specific process and equipment development projects from concept to full production launch.
• DFX & Collaboration: Partner closely with internal Product Design groups (HPS) and external customers early in the design phase.
• Thermal & Material Innovation Execution: Oversee Subject Matter Experts (SMEs) focused on high-power ASIC thermal modeling, liquid Thermal Interface Materials (TIM) application, signal integrity (CPO/Chip Package Optics), and material science interactions (micro-level pitch spacing, advanced soldering).
• System Integration Growth (L11/L12): Drive manufacturing and test strategies tailored for large, complex Level 11 (L11) integration and next-generation rack-level solutions.
• Operational Excellence & Urgency: Instill a strong culture of accountability and velocity.
• Global Standards & Succession: Manage the phased talent transition and succession planning for retiring legacy teams.

Requirements

• Semiconductor & Advanced Packaging Expertise: Deep understanding of large ASIC packages, silicon thermal dynamics, substrate warpage, coefficient of thermal expansion (CTE), and tight-pitch PCB manufacturing.
• Advanced Thermal Management: Familiarity with high-power cooling methodologies, thermal dissipation modeling, and liquid/pre-formed thermal interface materials.
• Testing Methodologies: Exposure to complex test architectures, including elevated temperature burn-in testers, functional testing, and optimizing capex/environmental footprints for test spaces.

Qualifications

Typical Experience: 15+ years of relevant engineering leadership experience within semiconductor, advanced electronic assembly, or hardware manufacturing environments.

Typical Education: Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, or an equivalent combination of education and experience.

Skills

• Velocity-Driven Leadership: A proven track record of driving projects with an intense sense of urgency.
• Project & Financial Management: Ability to lead high-value, multi-functional engineering projects with direct accountability to executive leadership.
• Assertive Stakeholder Management: Excellent negotiation and presentation skills to effectively manage relationships with Tier 1 hyperscale customers, suppliers, and internal global site leaders.

Work Environment

Environment: Standard office and advanced manufacturing lab environment.

Travel: Up to 25% travel (domestic and international), including key sites like San Jose, California and Thailand.