Co-Packaged Optics Process Development NPI engineer

About the Role

In this role, you will utilize your in-depth process engineering and partner management experience to drive Marvell’s AI products through NPI. You will be responsible for managing and driving the assembly process technology development in close collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost. Responsibilities include identification and mitigation of risk to new technologies used in product integration and ensuring factory readiness through maturing the product during the NPI phase.

This position requires hands-on experience in wafer process development, working with consumable suppliers, 2.5D/3D CoW assembly development, strong project management, and excellent written and verbal communication skills. A can-do attitude to prioritize and address issues with a high sense of urgency is essential.

Responsibilities

• Work with cross-functional packaging teams and lead process development at foundry along with 2.5D/3D CoW process development, with particular emphasis on chemistry development with packaging consumable suppliers at OSATs to bring packaging solutions from concept to prototypes and ramp to high-volume manufacturing with aggressive cost-reduction strategies.
• Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints.
• Manage internal and external resources effectively and efficiently toward established corporate milestones.
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts.

Requirements

• 10+ years of experience in Semiconductor Packaging, Process, and Technology Development.
• Expert-level understanding of advanced foundry process nodes and their interaction with Packaging/assembly/substrate across various package technologies.
• Expertise in advanced packaging technologies: knowledge and insight to deliver high-density/high-performance interconnects with TSVs in various 2.5D/3D package form factors.
• Proven track record of bringing products from technology development, package design/definition, qualification, NPI through HVM.
• Working-level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost.
• Familiarity with component and system-level reliability, testing, and FA.
• Experience with photonics packaging is preferred but not necessary.
• Experience in project management and communicating technical and project/program status and issue resolution at the executive level.
• Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability.
• Effective communicator, comfortable engaging with internal cross-functional teams as well as domestic and overseas suppliers.
• Excellent attention to detail, process and operationally oriented, self-driven with the ability to work independently and take projects to completion with minimum supervision.
• M.S or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.

Pay

Expected Base Pay Range (USD): $141,150 - $211,400 per annum. The successful candidate’s starting base pay will be determined based on job-related skills, experience, qualifications, work location, and market conditions.

Benefits

Marvell is committed to providing exceptional, comprehensive benefits that support employees at every stage—from internship to retirement and through life’s most important moments. Offerings include:

• Employee stock purchase plan with a 2-year look back.
• Family support programs to help balance work and home life.
• Robust mental health resources to prioritize emotional well-being.
• Recognition and service awards to celebrate contributions and milestones.