Co-Packaged Optics Packaging Process Development Engineer

About Marvell

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Responsibilities

• Utilize in-depth process engineering and partner management experience to drive AI products from concept to high volume manufacturing.
• Manage and drive assembly process technology development in collaboration with foundries and OSATs to ensure design for manufacturing, reliability, and cost.
• Identify and mitigate risks associated with new technologies used in product integration and ensure factory readiness through NPI phase maturation.
• Lead process development at foundry and 2.5D/3D CoW process development with a focus on chemistry development with packaging consumable suppliers at OSATs.
• Actively manage qualification of packages with sensitivity to physics of failures for high thermo-mechanical reliability, while operating within established cost constraints.
• Manage internal and external resources effectively and efficiently towards established corporate milestones.
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts.

Requirements

• 10+ years of experience in Semiconductor Packaging, Process and Technology Development.
• Expert level understanding of advanced foundry process node and its interaction with Packaging/assembly/substrate across various package technologies.
• Proven track record of bringing products from Technology development, package design/definition, qualification, NPI through HVM.
• Working level understanding of cross-functional packaging areas: package architecture, design rules, BOM, enabling material/process technologies, mechanical, design for manufacturing, reliability, and cost.
• Familiarity with component & system level reliability, testing, and FA.
• Experience with photonics packaging is preferred but not necessary.
• Excellent problem-solving skills with strong fundamentals in science, sound engineering judgment, and analytical ability.
• Effective communicator and comfortable engaging with internal cross-functional teams as well as domestic and overseas suppliers.
• Excellent attention to detail, process and operationally oriented, and self-driven with the ability to work independently and take projects to completion with minimum supervision.
• M.S or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry or Physics.

Qualifications

• Expertise in advanced packaging technologies: knowledge and insight to deliver high density/high performance interconnects with TSVs in various 2.5D/3D package form factors.
• Strong project management, written and verbal communication skills.
• A can-do attitude to prioritize and address issues with a high sense of urgency.

Skills

• Project Management
• Communication Skills
• Problem Solving
• Technical Proficiency

Benefits

• Employee Stock Purchase Plan
• Family Support Programs
• Mental Health Resources
• Recognition and Service Awards

Pay

Expected Base Pay Range (USD): $141,150 - $211,400, per annum. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefits

• Comprehensive benefits including financial well-being, family support, mental and physical health, and recognition.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews. These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.