Business Operations Director

Key Responsibilities

• Lead the end-to-end negotiation of Master Service Agreements (MSAs), Service Level Agreements (SLAs), and complex commercial contracts with global OSATs and backend vendors.
• Establish comprehensive pricing models (e.g., cost-plus, should-cost models, volume-based tiered pricing) to secure predictable, scalable unit costs for assembly and test.
• Manage request-for-proposal (RFP/RFQ) processes for new packaging technologies and high-volume testing platforms, evaluating total cost of ownership (TCO).
• Drive structured quarterly or annual business reviews (QBRs) to renegotiate commercial terms, wafer/die indexing, and substrate pricing adjustments based on market fluctuations.
• Own the operational relationship with OSAT partners and backend suppliers, negotiating terms and managing capacity allocation.
• Work with backend supply chain and Sales & Operations Planning (S&OP) to ensure uninterrupted material flow and support revenue forecasts.
• Mitigate supply chain risks and geopolitical exposure through multi-sourcing and regional diversification.

Business Operations & Financial Management

• Oversee the backend operational budget, including OpEx, CapEx planning, and headcount management.
• Drive cost optimization programs to reduce Cost of Goods Sold (COGS), improve gross margins, and achieve Annual Operating Plan (AOP) targets.
• Analyze operational data and develop strategic business plans to hit specific KPIs such as cycle time, OEE (Overall Equipment Effectiveness), and unit cost.

Manufacturing, Assembly & Test Ramp

• Oversee product ramp from the NPI phase to high-volume manufacturing (HVM) for all packaging, assembly, and test operations.
• Standardize testing platforms and cost reduction.
• Align factory capacity and resource allocation with product lifecycles and shifting market demands.

Qualifications & Requirements

• Education: Bachelor’s or Master’s degree in Electrical/Electronics Engineering, Industrial Engineering, or Supply Chain Management.
• Experience: 12+ years of progressive leadership experience in semiconductor manufacturing, with specific expertise in Assembly, Test, and Backend operations.
• Commercial Expertise: Proven track record of executing multi-million dollar MSAs and managing large-scale procurement or strategic sourcing for semiconductor components.
• Business Acumen: Demonstrated success in P&L ownership, gross margin improvement, and strategic supplier negotiations.
• Technical Knowledge: Understanding of automated testing environments (ATE), semiconductor packaging technologies, and backend MES (Manufacturing Execution Systems).
• Soft Skills: High-stakes negotiation skills, exceptional cross-functional leadership, data-driven analytical capability, and ability to manage global teams.